XCZU15EG-L1FFVB1156IXilinx
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    • 10 $9697344.468 $96973444.68
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    • Manufacturer No：
      XCZU15EG-L1FFVB1156I
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - System On Chip (SoC)
    • Datasheet：
      XCZU15EG-L1FFVB1156I
    • SKU：
      5177764
    • Description：
      IC SOC CORTEX-A53 1156FCBGA

    User Guide

    User Guide

    XCZU15EG-L1FFVB1156I Details

    IC SOC CORTEX-A53 1156FCBGA

    XCZU15EG-L1FFVB1156I Specification Parameters

    • Part Status: Active
    • Surface Mount: YES
    • Peak Reflow Temperature (Cel): NOT SPECIFIED
    • Published: 2016
    • Factory Lead Time: 11 Weeks
    • Terminal Form: BALL
    • Moisture Sensitivity Level (MSL): 4 (72 Hours)
    • RAM Size: 256kB
    • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
    • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
    • Series: Zynq? UltraScale+? MPSoC EG
    • Speed: 500MHz, 600MHz, 1.2GHz
    • Supply Voltage-Max (Vsup): 0.742V
    • JESD-30 Code: R-PBGA-B1156
    • RoHS Status: ROHS3 Compliant
    • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
    • Packaging: Tray
    • Technology: CMOS
    • Terminal Position: BOTTOM
    • HTS Code: 8542.31.00.01
    • Operating Temperature: -40°C~100°C TJ
    • Architecture: MCU, FPGA
    • Peripherals: DMA, WDT
    • Package / Case: 1156-BBGA, FCBGA
    • Number of I/O: 328
    • Supply Voltage: 0.72V
    • Supply Voltage-Min (Vsup): 0.698V
    • Additional Feature: ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    • Primary Attributes: Zynq?UltraScale+? FPGA, 747K+ Logic Cells
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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