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- Manufacturer No：XC4010E-3HQ208I
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC4010E-3HQ208I
- SKU：5177786
- Description：XC4000E/X XC4010E 208-BFQFP Exposed Pad Tin/Lead (Sn85Pb15) field programmable gate array 4.1mm 5V 125MHz 2ns
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XC4010E-3HQ208I Details
XC4000E/X XC4010E 208-BFQFP Exposed Pad Tin/Lead (Sn85Pb15) field programmable gate array 4.1mm 5V 125MHz 2ns
XC4010E-3HQ208I Specification Parameters
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Part Status: Obsolete
- Operating Supply Voltage: 5V
- Packaging: Tray
- Pbfree Code: no
- JESD-609 Code: e0
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Position: QUAD
- Published: 1999
- Subcategory: Field Programmable Gate Arrays
- Number of Equivalent Gates: 7000
- Terminal Finish: Tin/Lead (Sn85Pb15)
- Width: 28mm
- Number of I/O: 160
- Number of Inputs: 160
- Pin Count: 208
- Number of CLBs: 400
- Number of Logic Cells: 400
- Combinatorial Delay of a CLB-Max: 2 ns
- JESD-30 Code: S-PQFP-G208
- Number of Registers: 1120
- Package / Case: 208-BFQFP Exposed Pad
- Base Part Number: XC4010E
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Supply Voltage: 5V
- Power Supplies: 5V
- Speed Grade: 3
- Lead Free: Contains Lead
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Pitch: 0.5mm
- Voltage - Supply: 4.5V~5.5V
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Clock Frequency: 125MHz
- Length: 28mm
- Operating Temperature: -40°C~100°C TJ
- Number of Outputs: 160
- Number of Terminations: 208
- Height Seated (Max): 4.1mm
- Number of LABs/CLBs: 400
- Number of Gates: 10000
- Series: XC4000E/X
- Number of Logic Elements/Cells: 950
- Total RAM Bits: 12800
- RAM Size: 1.6kB
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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