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  • Manufacturer No:
    XA7Z020-1CLG484Q
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    XA7Z020-1CLG484Q
  • SKU:
    5177864
  • Description:
    IC SOC CORTEX-A9 667MHZ 484BGA

XA7Z020-1CLG484Q Details

IC SOC CORTEX-A9 667MHZ 484BGA

XA7Z020-1CLG484Q Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Height Seated (Max): 1.6mm
  • HTS Code: 8542.39.00.01
  • Terminal Pitch: 0.8mm
  • Operating Supply Voltage: 1V
  • Operating Temperature: -40°C~125°C TJ
  • Data Bus Width: 32b
  • Length: 19mm
  • Number of Pins: 484
  • Terminal Finish: TIN SILVER COPPER
  • UV Erasable: N
  • ECCN Code: 3A991.D
  • Frequency: 667MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Power Supplies: 11.8V
  • Package / Case: 484-LFBGA, CSPBGA
  • Series: Automotive, AEC-Q100, Zynq?-7000 XA
  • RoHS Status: ROHS3 Compliant
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Packaging: Tray
  • Qualification Status: Not Qualified
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Published: 2009
  • Terminal Position: BOTTOM
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Contact Plating: Copper, Silver, Tin
  • Core Architecture: ARM
  • Number of Terminations: 484
  • Number of I/O: 130
  • RAM Size: 256kB
  • Architecture: MCU, FPGA
  • uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Subcategory: Other uPs/uCs/Peripheral ICs
  • Peripherals: DMA
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Interface: CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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