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  • Manufacturer No:
    XCV200E-7PQ240C
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XCV200E-7PQ240C
  • SKU:
    5177904
  • Description:
    Contains Lead CMOS 2006 Non-RoHS Compliant FPGA 0C~85C TJ 14kB 0.42ns 400MHz

XCV200E-7PQ240C Details

Contains Lead CMOS 2006 Non-RoHS Compliant FPGA 0C~85C TJ 14kB 0.42ns 400MHz

XCV200E-7PQ240C Specification Parameters

  • Mounting Type: Surface Mount
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Packaging: Tray
  • Lead Free: Contains Lead
  • Terminal Form: GULL WING
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Supply Voltage: 1.8V
  • Published: 2006
  • Speed Grade: 7
  • HTS Code: 8542.39.00.01
  • Number of Terminations: 240
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Peak Reflow Temperature (Cel): 225
  • Operating Temperature: 0°C~85°C TJ
  • Width: 32mm
  • Height Seated (Max): 4.1mm
  • RAM Size: 14kB
  • Number of Outputs: 158
  • Series: Virtex?-E
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 114688
  • Base Part Number: XCV200E
  • Mount: Surface Mount
  • Radiation Hardening: No
  • Part Status: Obsolete
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Operating Supply Voltage: 1.8V
  • Terminal Pitch: 0.5mm
  • Terminal Position: QUAD
  • Number of Pins: 240
  • Pin Count: 240
  • Subcategory: Field Programmable Gate Arrays
  • Terminal Finish: Tin/Lead (Sn85Pb15)
  • Length: 32mm
  • Clock Frequency: 400MHz
  • Voltage - Supply: 1.71V~1.89V
  • Number of I/O: 158
  • Package / Case: 240-BFQFP
  • Combinatorial Delay of a CLB-Max: 0.42 ns
  • Number of LABs/CLBs: 1176
  • Number of Gates: 306393
  • Number of Equivalent Gates: 63504

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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