XC6SLX25T-2CSG324CXilinx
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    • Manufacturer No：
      XC6SLX25T-2CSG324C
    • Manufacturer：
      Xilinx
    • Category：
      Embedded - FPGAs (Field Programmable Gate Array)
    • Datasheet：
      XC6SLX25T-2CSG324C
    • SKU：
      5178121
    • Description：
      CMOS 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 117kB 667MHz 1.2V

    User Guide

    User Guide

    XC6SLX25T-2CSG324C Details

    CMOS 2008 ROHS3Compliant BALL FPGA 0C~85C TJ 117kB 667MHz 1.2V

    XC6SLX25T-2CSG324C Specification Parameters

    • Part Status: Active
    • Speed Grade: 2
    • Mount: Surface Mount
    • Pbfree Code: yes
    • Factory Lead Time: 10 Weeks
    • Technology: CMOS
    • Moisture Sensitivity Level (MSL): 3 (168 Hours)
    • Published: 2008
    • Terminal Pitch: 0.8mm
    • JESD-609 Code: e1
    • Operating Supply Voltage: 1.2V
    • Width: 15mm
    • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
    • Operating Temperature: 0°C~85°C TJ
    • Voltage - Supply: 1.14V~1.26V
    • Number of Pins: 324
    • Clock Frequency: 667MHz
    • Number of Outputs: 190
    • Series: Spartan?-6 LXT
    • Number of LABs/CLBs: 1879
    • Number of Registers: 30064
    • Base Part Number: XC6SLX25
    • RoHS Status: ROHS3 Compliant
    • Mounting Type: Surface Mount
    • ECCN Code: EAR99
    • Packaging: Tray
    • Qualification Status: Not Qualified
    • Peak Reflow Temperature (Cel): 260
    • Time@Peak Reflow Temperature-Max (s): 30
    • Terminal Position: BOTTOM
    • Terminal Form: BALL
    • Supply Voltage: 1.2V
    • Length: 15mm
    • Height Seated (Max): 1.5mm
    • Subcategory: Field Programmable Gate Arrays
    • Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    • Number of Terminations: 324
    • Pin Count: 324
    • Number of I/O: 190
    • Package / Case: 324-LFBGA, CSPBGA
    • RAM Size: 117kB
    • Number of Logic Elements/Cells: 24051
    • Total RAM Bits: 958464
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    Xilinx — Manufacturer Introduction

    Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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