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- Manufacturer No：XC3S100E-4CP132C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XC3S100E-4CP132C
- SKU：5178297
- Description：Spartan®-3E 132-TFBGA CSPBGA Tin/Lead (Sn63Pb37) Surface Mount field programmable gate array 1.1mm 1.2V 572MHz 0.76ns
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User Guide
XC3S100E-4CP132C Details
Spartan®-3E 132-TFBGA CSPBGA Tin/Lead (Sn63Pb37) Surface Mount field programmable gate array 1.1mm 1.2V 572MHz 0.76ns
XC3S100E-4CP132C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Speed Grade: 4
- Factory Lead Time: 10 Weeks
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- Terminal Pitch: 0.5mm
- Terminal Form: BALL
- Number of CLBs: 240
- Supply Voltage: 1.2V
- Number of Outputs: 72
- Width: 8mm
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Number of Terminations: 132
- Pin Count: 132
- Number of I/O: 83
- RAM Size: 9kB
- Total RAM Bits: 73728
- Number of Logic Elements/Cells: 2160
- Series: Spartan?-3E
- Package / Case: 132-TFBGA, CSPBGA
- Packaging: Bulk
- ECCN Code: EAR99
- Surface Mount: YES
- Pbfree Code: no
- Qualification Status: Not Qualified
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Published: 2008
- Terminal Position: BOTTOM
- Peak Reflow Temperature (Cel): 240
- Number of LABs/CLBs: 240
- Operating Supply Voltage: 1.2V
- Length: 8mm
- Height Seated (Max): 1.1mm
- Subcategory: Field Programmable Gate Arrays
- Operating Temperature: 0°C~85°C TJ
- Number of Pins: 132
- Voltage - Supply: 1.14V~1.26V
- Power Supplies: 1.21.2/3.32.5V
- Number of Gates: 100000
- Number of Registers: 1920
- Clock Frequency: 572MHz
- Combinatorial Delay of a CLB-Max: 0.76 ns
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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