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- Manufacturer No：XCF32PFSG48C
- Manufacturer：Xilinx
- Category：Memory - Configuration Proms for FPGAs
- Datasheet：XCF32PFSG48C
- SKU：5178343
- Description：XCF*P Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) EAR99 Tray ics fpga configuration 8mm 0.04mA 32Mb 1.5/3.31.8V
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XCF32PFSG48C Details
XCF*P Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) EAR99 Tray ics fpga configuration 8mm 0.04mA 32Mb 1.5/3.31.8V
XCF32PFSG48C Specification Parameters
- Part Status: Active
- Mounting Type: Surface Mount
- Number of Functions: 1
- Pbfree Code: yes
- Packaging: Tray
- Factory Lead Time: 10 Weeks
- Termination: SMD/SMT
- Peak Reflow Temperature (Cel): 260
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Number of Terminations: 48
- Pin Count: 48
- Terminal Position: BOTTOM
- Width: 8mm
- Length: 9mm
- Operating Mode: SYNCHRONOUS
- HTS Code: 8542.32.00.51
- Supply Current-Max: 0.04mA
- Interface: Parallel, Serial
- Memory Density: 33554432 bit
- Voltage - Supply: 1.65V~2V
- Organization: 32MX1
- Package / Case: 48-TFBGA, CSPBGA
- Base Part Number: XCF*P
- RoHS Status: ROHS3 Compliant
- Mount: Surface Mount
- ECCN Code: EAR99
- Lead Free: Lead Free
- Operating Temperature: -40°C~85°C
- Qualification Status: Not Qualified
- Technology: CMOS
- Data Retention Time-Min: 20
- Time@Peak Reflow Temperature-Max (s): 30
- REACH SVHC: Unknown
- Number of Pins: 48
- Supply Voltage-Max (Vsup): 2V
- Terminal Form: BALL
- Published: 1999
- JESD-609 Code: e2
- Supply Voltage-Min (Vsup): 1.65V
- Programmable Type: In System Programmable
- Subcategory: Flash Memories
- Height: 860μm
- Memory Size: 32MB
- Terminal Finish: Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
- Power Supplies: 1.5/3.31.8V
- Endurance: 20000 Write/Erase Cycles
- Additional Feature: IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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