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- Manufacturer No：XCZU4EG-L2FBVB900E
- Manufacturer：Xilinx
- Category：Embedded - System On Chip (SoC)
- Datasheet：XCZU4EG-L2FBVB900E
- SKU：5178895
- Description：BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz 0.72V
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User Guide
XCZU4EG-L2FBVB900E Details
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC 0C~100C TJ 256KB 533MHz 600MHz 1.3GHz 0.72V
XCZU4EG-L2FBVB900E Specification Parameters
- Part Status: Active
- Surface Mount: YES
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Published: 2016
- Factory Lead Time: 11 Weeks
- Terminal Form: BALL
- Moisture Sensitivity Level (MSL): 4 (72 Hours)
- Number of Terminations: 900
- uPs/uCs/Peripheral ICs Type: MICROPROCESSOR CIRCUIT
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Package / Case: 900-BBGA, FCBGA
- Supply Voltage: 0.72V
- Supply Voltage-Min (Vsup): 0.698V
- Additional Feature: ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- JESD-30 Code: R-PBGA-B900
- RoHS Status: ROHS3 Compliant
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Packaging: Tray
- Technology: CMOS
- Terminal Position: BOTTOM
- HTS Code: 8542.31.00.01
- RAM Size: 256kB
- Architecture: MCU, FPGA
- Operating Temperature: 0°C~100°C TJ
- Number of I/O: 204
- Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Series: Zynq? UltraScale+? MPSoC EG
- Speed: 533MHz, 600MHz, 1.3GHz
- Supply Voltage-Max (Vsup): 0.742V
- Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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