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- Manufacturer No：XCR3256XL-12TQ144C
- Manufacturer：Xilinx
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：XCR3256XL-12TQ144C
- SKU：5179480
- Description：YES 144-LQFP 2003 XCR3256XL complex programmable logic device 88MHz 20mm 10.8ns 3V~3.6V
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User Guide
XCR3256XL-12TQ144C Details
YES 144-LQFP 2003 XCR3256XL complex programmable logic device 88MHz 20mm 10.8ns 3V~3.6V
XCR3256XL-12TQ144C Specification Parameters
- Part Status: Active
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Additional Feature: YES
- Operating Supply Voltage: 3.3V
- Pbfree Code: no
- Lead Free: Contains Lead
- JESD-609 Code: e0
- Terminal Form: GULL WING
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Speed Grade: 12
- Terminal Pitch: 0.5mm
- HTS Code: 8542.39.00.01
- Published: 2003
- Length: 20mm
- Voltage Supply - Internal: 3V~3.6V
- Number of Macro Cells: 256
- Memory Type: EEPROM
- Number of Pins: 144
- Terminal Finish: Tin/Lead (Sn85Pb15)
- Propagation Delay: 12 ns
- Package / Case: 144-LQFP
- Programmable Type: In System Programmable (min 1K program/erase cycles)
- Series: CoolRunner XPLA3
- Base Part Number: XCR3256XL
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JTAG BST: YES
- Supply Voltage: 3.3V
- Packaging: Tray
- Factory Lead Time: 10 Weeks
- Qualification Status: Not Qualified
- Number of Logic Elements/Cells: 16
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Height Seated (Max): 1.6mm
- Terminal Position: QUAD
- Supply Voltage-Max (Vsup): 3.6V
- Operating Temperature: 0°C~70°C TA
- Width: 20mm
- Number of I/O: 120
- Peak Reflow Temperature (Cel): 225
- Number of Terminations: 144
- Pin Count: 144
- Output Function: MACROCELL
- Subcategory: Programmable Logic Devices
- Number of Gates: 6000
- Max Frequency: 88MHz
- Delay Time tpd(1) Max: 10.8ns
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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