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  • 1 $487.283 $487.283
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  • Manufacturer No:
    XC7Z030-2FBG484I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - System On Chip (SoC)
  • Datasheet:
    XC7Z030-2FBG484I
  • SKU:
    5179558
  • Description:
    IC SOC CORTEX-A9 800MHZ 484FCBGA

XC7Z030-2FBG484I Details

IC SOC CORTEX-A9 800MHZ 484FCBGA

XC7Z030-2FBG484I Specification Parameters

  • Part Status: Active
  • ECCN Code: EAR99
  • Surface Mount: YES
  • Packaging: Tray
  • Height Seated (Max): 2.54mm
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • JESD-609 Code: e1
  • Contact Plating: Copper, Silver, Tin
  • Data Bus Width: 32b
  • Length: 23mm
  • Number of Terminations: 484
  • Peak Reflow Temperature (Cel): 250
  • Frequency: 800MHz
  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Package / Case: 484-BBGA, FCBGA
  • Series: Zynq?-7000
  • RAM (words): 256000
  • Bus Compatibility: CAN; ETHERNET; I2C; SPI; UART; USB
  • Base Part Number: XC7Z030
  • RoHS Status: ROHS3 Compliant
  • Radiation Hardening: No
  • Boundary Scan: YES
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Published: 2009
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Operating Supply Voltage: 1V
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Moisture Sensitivity Level (MSL): 4 (72 Hours)
  • Core Architecture: ARM
  • Operating Temperature: -40°C~100°C TJ
  • Number of Pins: 484
  • Number of I/O: 130
  • RAM Size: 256kB
  • Supply Voltage-Max (Vsup): 1.05V
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals: DMA
  • Interface: CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Speed Grade: -2
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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