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- Manufacturer No：XCV600E-8BG432C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCV600E-8BG432C
- SKU：5180026
- Description：Virtex®-E XCV600E 432-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.8V 416MHz 0.4ns
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User Guide
XCV600E-8BG432C Details
Virtex®-E XCV600E 432-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.8V 416MHz 0.4ns
XCV600E-8BG432C Specification Parameters
- Mounting Type: Surface Mount
- Radiation Hardening: No
- Part Status: Obsolete
- Packaging: Tray
- Lead Free: Contains Lead
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- Terminal Position: BOTTOM
- Published: 1999
- Subcategory: Field Programmable Gate Arrays
- Length: 40mm
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Operating Temperature: 0°C~85°C TJ
- Number of Outputs: 316
- ECCN Code: 3A991.D
- Number of Terminations: 432
- Combinatorial Delay of a CLB-Max: 0.4 ns
- RAM Size: 36kB
- Clock Frequency: 416MHz
- JESD-30 Code: S-PBGA-B432
- Number of LABs/CLBs: 3456
- Base Part Number: XCV600E
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Speed Grade: 8
- Pbfree Code: no
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Terminal Pitch: 1.27mm
- Terminal Form: BALL
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Width: 40mm
- Height Seated (Max): 1.7mm
- Number of I/O: 316
- Number of Inputs: 316
- Pin Count: 432
- Voltage - Supply: 1.71V~1.89V
- Total RAM Bits: 294912
- Series: Virtex?-E
- Number of Logic Elements/Cells: 15552
- Package / Case: 432-LBGA Exposed Pad, Metal
- Number of Gates: 985882
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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