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- Manufacturer No：XCV2000E-8BG560C
- Manufacturer：Xilinx
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：XCV2000E-8BG560C
- SKU：5180241
- Description：Virtex®-E XCV2000E 560-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.8V 416MHz 0.4ns
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User Guide
XCV2000E-8BG560C Details
Virtex®-E XCV2000E 560-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.8V 416MHz 0.4ns
XCV2000E-8BG560C Specification Parameters
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- RoHS Status: Non-RoHS Compliant
- Speed Grade: 8
- Pbfree Code: no
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Supply Voltage: 1.8V
- Terminal Pitch: 1.27mm
- Published: 2004
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Peak Reflow Temperature (Cel): 225
- Height Seated (Max): 1.7mm
- Length: 42.5mm
- Voltage - Supply: 1.71V~1.89V
- Number of I/O: 404
- Combinatorial Delay of a CLB-Max: 0.4 ns
- Pin Count: 560
- Series: Virtex?-E
- Clock Frequency: 416MHz
- Total RAM Bits: 655360
- Number of Logic Elements/Cells: 43200
- Base Part Number: XCV2000E
- Mount: Surface Mount
- Radiation Hardening: No
- Part Status: Obsolete
- Packaging: Tray
- Lead Free: Contains Lead
- Technology: CMOS
- Time@Peak Reflow Temperature-Max (s): 30
- Operating Supply Voltage: 1.8V
- Terminal Position: BOTTOM
- Terminal Form: BALL
- Subcategory: Field Programmable Gate Arrays
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Operating Temperature: 0°C~85°C TJ
- Width: 42.5mm
- Number of Outputs: 404
- Number of Inputs: 404
- Number of Terminations: 560
- RAM Size: 80kB
- Number of LABs/CLBs: 9600
- Package / Case: 560-LBGA Exposed Pad, Metal
- JESD-30 Code: S-PBGA-B560
- Number of Gates: 2541952
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Xilinx — Manufacturer Introduction
Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.
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