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  • Manufacturer No:
    XCF08PFS48C
  • Manufacturer:
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    Get the PDF file
  • SKU:
    5180307
  • Description:
    XCF08PFS48C Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.001A 8Mb 1.8V
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  • Manufacturer No:
    XCF08PFS48C
  • Manufacturer:
    Xilinx
  • Category:
    Memory - Configuration Proms for FPGAs
  • Datasheet:
    XCF08PFS48C
  • SKU:
    5180307
  • Description:
    XCF08PFS48C Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.001A 8Mb 1.8V

XCF08PFS48C Details

XCF08PFS48C Tin/Lead (Sn63Pb37) EAR99 Tray ics fpga configuration 8mm 0.001A 8Mb 1.8V

XCF08PFS48C Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • RoHS Status: Non-RoHS Compliant
  • Operating Temperature: -40°C~85°C
  • Factory Lead Time: 10 Weeks
  • Technology: CMOS
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Operating Supply Voltage: 1.8V
  • Number of Pins: 48
  • Supply Voltage-Max (Vsup): 2V
  • Terminal Form: BALL
  • Published: 1999
  • Parallel/Serial: SERIAL
  • Clock Frequency: 33MHz
  • HTS Code: 8542.32.00.51
  • Supply Current-Max: 0.04mA
  • Height: 860μm
  • Memory Density: 8388608 bit
  • Voltage - Supply: 1.65V~2V
  • Package / Case: 48-TFBGA, CSPBGA
  • Endurance: 20000 Write/Erase Cycles
  • Mounting Type: Surface Mount
  • Number of Functions: 1
  • Radiation Hardening: No
  • Packaging: Tray
  • Pbfree Code: no
  • JESD-609 Code: e0
  • Data Retention Time-Min: 20
  • Supply Voltage: 1.8V
  • Number of Terminations: 48
  • Pin Count: 48
  • Terminal Position: BOTTOM
  • Width: 8mm
  • Length: 9mm
  • Terminal Finish: Tin/Lead (Sn63Pb37)
  • Supply Voltage-Min (Vsup): 1.65V
  • Programmable Type: In System Programmable
  • Subcategory: Flash Memories
  • Standby Current-Max: 0.001A
  • Memory IC Type: CONFIGURATION MEMORY
  • Memory Size: 8MB
  • Organization: 8MX1

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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