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  • Manufacturer No:
    XC7S75-1FGGA484Q
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5472559
  • Description:
    ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~125C TJ 1.27ns 1V 2.44mm
  • Quantity:
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  • Qty Unit Price price
  • 1 $193306.419 $193306.419
  • 10 $191392.494 $1913924.94
  • 100 $189497.518 $18949751.8
  • 1000 $187621.304 $187621304
  • 10000 $185763.6667 $1857636667

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  • Manufacturer No:
    XC7S75-1FGGA484Q
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7S75-1FGGA484Q
  • SKU:
    5472559
  • Description:
    ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~125C TJ 1.27ns 1V 2.44mm

XC7S75-1FGGA484Q Details

ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~125C TJ 1.27ns 1V 2.44mm

XC7S75-1FGGA484Q Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • JESD-609 Code: e3
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Terminal Finish: Matte Tin (Sn)
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Width: 23mm
  • Package / Case: 484-BGA
  • Number of LABs/CLBs: 6000
  • Voltage - Supply: 0.95V~1.05V
  • Combinatorial Delay of a CLB-Max: 1.27 ns
  • Number of Logic Elements/Cells: 76800
  • RoHS Status: ROHS3 Compliant
  • Surface Mount: YES
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Operating Temperature: -40°C~125°C TJ
  • Length: 23mm
  • Number of Terminations: 484
  • Height Seated (Max): 2.44mm
  • JESD-30 Code: S-PBGA-B484
  • Number of I/O: 338
  • Series: Spartan?-7
  • Total RAM Bits: 4331520

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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