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  • Manufacturer No:
    XC7K410T-1FFV900I
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5472564
  • Description:
    ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~100C TJ 0.74ns 1V 3.35mm
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  • Manufacturer No:
    XC7K410T-1FFV900I
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7K410T-1FFV900I
  • SKU:
    5472564
  • Description:
    ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~100C TJ 0.74ns 1V 3.35mm

XC7K410T-1FFV900I Details

ROHS3Compliant BALL Active BOTTOM field programmable gate array -40C~100C TJ 0.74ns 1V 3.35mm

XC7K410T-1FFV900I Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Factory Lead Time: 12 Weeks
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Number of I/O: 500
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Length: 31mm
  • Number of Terminations: 900
  • Height Seated (Max): 3.35mm
  • Package / Case: 900-BBGA, FCBGA
  • Combinatorial Delay of a CLB-Max: 0.74 ns
  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • RoHS Status: ROHS3 Compliant
  • Surface Mount: YES
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • JESD-609 Code: e1
  • Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
  • Operating Temperature: -40°C~100°C TJ
  • Width: 31mm
  • ECCN Code: 3A991.D
  • Voltage - Supply: 0.97V~1.03V
  • Series: Kintex?-7
  • JESD-30 Code: S-PBGA-B900
  • Total RAM Bits: 29306880

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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