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  • Manufacturer No:
    XC7S100-1FGGA676Q
  • Manufacturer:
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    Get the PDF file
  • SKU:
    5472579
  • Description:
    Spartan®-7 676-BGA Matte Tin (Sn) Surface Mount field programmable gate array 2.44mm 1V 1.27ns -40C~125C TJ
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  • Manufacturer No:
    XC7S100-1FGGA676Q
  • Manufacturer:
    Xilinx
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    XC7S100-1FGGA676Q
  • SKU:
    5472579
  • Description:
    Spartan®-7 676-BGA Matte Tin (Sn) Surface Mount field programmable gate array 2.44mm 1V 1.27ns -40C~125C TJ

XC7S100-1FGGA676Q Details

Spartan®-7 676-BGA Matte Tin (Sn) Surface Mount field programmable gate array 2.44mm 1V 1.27ns -40C~125C TJ

XC7S100-1FGGA676Q Specification Parameters

  • Part Status: Active
  • Mounting Type: Surface Mount
  • JESD-609 Code: e3
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Terminal Finish: Matte Tin (Sn)
  • Terminal Pitch: 1mm
  • Terminal Position: BOTTOM
  • Supply Voltage: 1V
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Width: 27mm
  • Height Seated (Max): 2.44mm
  • Number of LABs/CLBs: 8000
  • Package / Case: 676-BGA
  • Combinatorial Delay of a CLB-Max: 1.27 ns
  • Number of Logic Elements/Cells: 102400
  • RoHS Status: ROHS3 Compliant
  • Surface Mount: YES
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Factory Lead Time: 10 Weeks
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • HTS Code: 8542.39.00.01
  • Terminal Form: BALL
  • Operating Temperature: -40°C~125°C TJ
  • Length: 27mm
  • Number of I/O: 400
  • Number of Terminations: 676
  • Voltage - Supply: 0.95V~1.05V
  • JESD-30 Code: S-PBGA-B676
  • Series: Spartan?-7
  • Total RAM Bits: 4423680

Xilinx — Manufacturer Introduction

Xilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs. Xilinx uniquely enables applications that are both software defined, yet hardware optimized - powering industry advancements in Cloud Computing, SDN/NFV, Video/Vision, Industrial IoT and 5G Wireless.

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