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  • Manufacturer No:
    RC2012J000CS
  • Manufacturer:
  • Category:
    Chip Resistor - Surface Mount
  • Datasheet:
    Get the PDF file
  • SKU:
    9358334
  • Description:
    0805 (2012Metric) 0805 RC 0.079Lx0.049W 2.00mmx1.25mm 0.125W 1/8W 0Ohms 200ppm/C
  • Quantity:
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Inventory:0
  • Qty Unit Price price
  • 1 $0.014 $0.014
  • 10 $0.013 $0.13
  • 100 $0.012 $1.2
  • 1000 $0.011 $11
  • 10000 $0.0105 $105

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  • Manufacturer No:
    RC2012J000CS
  • Manufacturer:
    Samsung
  • Category:
    Chip Resistor - Surface Mount
  • Datasheet:
    RC2012J000CS
  • SKU:
    9358334
  • Description:
    0805 (2012Metric) 0805 RC 0.079Lx0.049W 2.00mmx1.25mm 0.125W 1/8W 0Ohms 200ppm/C

RC2012J000CS Details

0805 (2012Metric) 0805 RC 0.079Lx0.049W 2.00mmx1.25mm 0.125W 1/8W 0Ohms 200ppm/C

RC2012J000CS Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Radiation Hardening: No
  • Contact Plating: Tin
  • Operating Temperature: -55°C~155°C
  • Case Code (Metric): 2012
  • Max Power Dissipation: 125mW
  • Voltage - Rated DC: 150V
  • Length: 2mm
  • Case Code (Imperial): 0805
  • Feature: Moisture Resistant
  • Published: 2008
  • Depth: 1.25mm
  • Height: 609.6μm
  • Temperature Coefficient: 200 ppm/°C
  • Factory Lead Time: 47 Weeks
  • Resistance: 0Ohms
  • RoHS Status: ROHS3 Compliant
  • Number of Terminations: 2
  • Packaging: Tape & Reel (TR)
  • Lead Free: Lead Free
  • Min Operating Temperature: -55°C
  • Composition: Thick Film
  • Power Rating: 125mW
  • Package / Case: 0805 (2012 Metric)
  • Size / Dimension: 0.079Lx0.049W 2.00mmx1.25mm
  • Power (Watts): 0.125W 1/8W
  • Supplier Device Package: 0805
  • Max Operating Temperature: 155°C
  • Military Standard: Not
  • Height Seated (Max): 0.026 0.65mm
  • Series: RC
  • Width: 1.2446mm
  • Tolerance: Jumper

Samsung — Manufacturer Introduction

Samsung Electro Mechanics (SEMCO) is a leading supplier of a wide range of high-performance electronics components. Since 1973, SEMCO is driving the edge of miniaturization for increasingly challenged industrial designs of end products without compromising the quality and performance.

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