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  • Manufacturer No:
    CL31X476KQHNNNE
  • Manufacturer:
  • Category:
    Ceramic Capacitors
  • Datasheet:
    Get the PDF file
  • SKU:
    9464782
  • Description:
    1206 (3216Metric) CERAMIC CAPACITOR CL 6.3V 47muF ±10% X6S
  • Quantity:
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  • Material flow:
  • Payment:
Inventory:435554
  • Qty Unit Price price
  • 1 $1046.85 $1046.85
  • 10 $1036.485 $10364.85
  • 100 $1026.222 $102622.2
  • 1000 $1016.061 $1016061
  • 10000 $1006 $10060000

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  • Manufacturer No:
    CL31X476KQHNNNE
  • Manufacturer:
    Samsung
  • Category:
    Ceramic Capacitors
  • Datasheet:
    CL31X476KQHNNNE
  • SKU:
    9464782
  • Description:
    1206 (3216Metric) CERAMIC CAPACITOR CL 6.3V 47muF ±10% X6S

CL31X476KQHNNNE Details

1206 (3216Metric) CERAMIC CAPACITOR CL 6.3V 47muF ±10% X6S

CL31X476KQHNNNE Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Applications: General Purpose
  • Multilayer: Yes
  • Package / Case: 1206 (3216 Metric)
  • Case Code (Imperial): 1206
  • Published: 2008
  • Operating Temperature: -55°C~105°C
  • Terminal Finish: Tin (Sn) - with Nickel (Ni) barrier
  • Factory Lead Time: 22 Weeks
  • Packing Method: TR, Embossed Plastic, 7 Inch
  • Capacitance: 47μF
  • Series: CL
  • Temperature Coefficient: X6S
  • RoHS Status: ROHS3 Compliant
  • Number of Terminations: 2
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • Terminal Shape: WRAPAROUND
  • Mounting Type: Surface Mount, MLCC
  • Tolerance: ±10%
  • Dielectric Material: Ceramic
  • Size / Dimension: 0.126Lx0.063W 3.20mmx1.60mm
  • Capacitor Type: CERAMIC CAPACITOR
  • HTS Code: 8532.24.00.20
  • Case Code (Metric): 3216
  • Thickness (Max): 0.071 1.80mm
  • Voltage - Rated DC: 6.3V
  • Thickness: 1.8034mm
  • Temperature Characteristics Code: X6S

Samsung — Manufacturer Introduction

Samsung Electro Mechanics (SEMCO) is a leading supplier of a wide range of high-performance electronics components. Since 1973, SEMCO is driving the edge of miniaturization for increasingly challenged industrial designs of end products without compromising the quality and performance.

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