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MRF581G123
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MRF581G
  • Manufacturer No:
    MRF581G
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Transistors - Bipolar (BJT) - RF
  • Datasheet:
    MRF581G
  • SKU:
    9748314
  • Description:
    RF TRANS NPN 18V 5GHZ MICRO X

MRF581G Details

RF TRANS NPN 18V 5GHZ MICRO X

MRF581G Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • Number of Elements: 1
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Number of Terminations: 4
  • Qualification Status: Not Qualified
  • Published: 2008
  • Configuration: Single
  • JESD-609 Code: e1
  • Max Collector Current: 200mA
  • Transistor Type: NPN
  • Operating Temperature: 150°C TJ
  • Transistor Application: AMPLIFIER
  • Terminal Finish: TIN SILVER COPPER
  • Collector-Base Capacitance-Max: 3pF
  • Frequency - Transition: 5GHz
  • Transition Frequency: 5000MHz
  • JESD-30 Code: O-PRDB-F4
  • Package / Case: Micro-X ceramic (84C)
  • Base Part Number: MRF581
  • Packaging: Bulk
  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • Pbfree Code: yes
  • Part Status: Obsolete
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Pin Count: 4
  • Reach Compliance Code: unknown
  • Transistor Element Material: SILICON
  • Collector Emitter Breakdown Voltage: 18V
  • Terminal Form: FLAT
  • Current - Collector (Ic) (Max): 200mA
  • Polarity/Channel Type: NPN
  • Subcategory: Other Transistors
  • Max Power Dissipation: 1.25W
  • Terminal Position: RADIAL
  • Additional Feature: LOW NOISE
  • Highest Frequency Band: ULTRA HIGH FREQUENCY B
  • DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 50mA 5V
  • Gain: 13dB ~ 15.5dB
  • Noise Figure (dB Typ @ f): 3dB ~ 3.5dB @ 500MHz

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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