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- Manufacturer No：8432-11B1-RK-TP
- Manufacturer：3M
- Category：Sockets for ICs, Transistors
- Datasheet：8432-11B1-RK-TP
- SKU：1973882
- Description：CONN SOCKET PLCC 32POS TIN
User Guide
User Guide
8432-11B1-RK-TP Details
CONN SOCKET PLCC 32POS TIN
8432-11B1-RK-TP Specification Parameters
- Part Status: Active
- Mounting Type: Through Hole
- RoHS Status: RoHS Compliant
- Lead Free: Lead Free
- Termination: Solder
- Contact Finish - Post: Tin
- Material Flammability Rating: UL94 V-0
- Pitch - Post: 0.100 2.54mm
- Number of Rows: 4
- Packaging: Tube
- Pitch: 2.54mm
- Contact Material - Mating: Copper Alloy
- Orientation: Straight
- Published: 2006
- Lead Pitch: 1.27mm
- Max Operating Temperature: 105°C
- Number of Pins: 32
- Contact Material: Copper
- Contact Resistance: 30mOhm
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Feature: Closed Frame
- Width: 17.9mm
- Depth: 20.6mm
- Contact Finish Thickness - Mating: 160.0μin 4.06μm
- Series: 8400
- Length: 18.05mm
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Through Hole
- Radiation Hardening: No
- Color: Black
- Contact Plating: Tin
- Contact Finish - Mating: Tin
- Flammability Rating: UL94 V-0
- Gender: Female
- Factory Lead Time: 8 Weeks
- Min Operating Temperature: -40°C
- REACH SVHC: No SVHC
- Contact Material - Post: Copper Alloy
- Pitch - Mating: 0.050 1.27mm
- Current Rating (Amps): 1A
- Operating Temperature: -40°C~105°C
- Number of Positions: 32
- Number of Contacts: 32
- Connector Type: Socket
- Height: 8mm
- Insulation Material: Polybutylene
- Type: PLCC
- Termination Post Length: 0.132 3.35mm
- Row Spacing: 10.16 mm
- Contact Finish Thickness - Post: 160.0μin 4.06μm
- Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
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3M — Manufacturer Introduction
3M offers innovative solutions to the electronics industry and is a leading manufacturer of interconnect solutions for board-to-board, wire-to-board, backplane and input/output (I/O) applications. These include 3M? Wiremount Insulation Displacement Contact (IDC) Connectors, Mini Delta Ribbon (MDR) I/O System, Mini-Clamp Discrete Wire System, MetPak? High Speed Hard Metric (HSHM) and the new Ultra Hard Metric (UHM) Backplane Connectors. Using industry leading capabilities in CAD - such as NX? and SLA modeling - 3M's experienced engineers turn ideas into real world solutions. 3M offers solutions for printed circuit board fabrication, board assembly and test, such as adhesives and tapes, embedded capacitor materials, Textool? Test and Burn-in Sockets, carrier and cover tapes and trays, flexible circuits, and products for reducing electrostatic discharge. 3M also offers solutions for shielding from EMI/RFI, for thermal management and vibration damping, as well as for packaging and labeling.
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