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- Manufacturer No：2N7002H-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：2N7002H-13
- SKU：1729142
- Description：Tape & Reel (TR) Surface Mount N-Channel SINGLE WITH BUILT-IN DIODE Mosfet Transistor 170mA Ta 170mA 370mW Ta 60V
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2N7002H-13 Details
Tape & Reel (TR) Surface Mount N-Channel SINGLE WITH BUILT-IN DIODE Mosfet Transistor 170mA Ta 170mA 370mW Ta 60V
2N7002H-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- Pbfree Code: yes
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Terminal Position: DUAL
- Number of Terminations: 3
- Drain to Source Voltage (Vdss): 60V
- Factory Lead Time: 14 Weeks
- Operating Temperature: -55°C~150°C TJ
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Terminal Finish: Matte Tin (Sn) - annealed
- Vgs (Max): ±20V
- Configuration: SINGLE WITH BUILT-IN DIODE
- Continuous Drain Current (ID): 170mA
- Reference Standard: AEC-Q101
- Drain Current-Max (Abs) (ID): 0.17A
- Power Dissipation-Max: 370mW Ta
- Gate Charge (Qg) (Max) @ Vgs: 0.35nC @ 4.5V
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- ECCN Code: EAR99
- JESD-609 Code: e3
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Drive Voltage (Max Rds On,Min Rds On): 5V
- Terminal Form: GULL WING
- DS Breakdown Voltage-Min: 60V
- Transistor Element Material: SILICON
- Published: 2000
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Additional Feature: HIGH RELIABILITY
- JESD-30 Code: R-PDSO-G3
- Vgs(th) (Max) @ Id: 3V @ 250μA
- HTS Code: 8541.21.00.95
- Current - Continuous Drain (Id) @ 25°C: 170mA Ta
- Rds On (Max) @ Id, Vgs: 7.5 Ω @ 50mA, 5V
- Input Capacitance (Ciss) (Max) @ Vds: 26pF @ 25V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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