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- Manufacturer No：74LVC1G00SE-7
- Manufacturer：Diodes Incorporated
- Category：Logic - Gates and Inverters
- Datasheet：74LVC1G00SE-7
- SKU：1730114
- Description：NAND 74LVC1G00 e3 74LVC logic gate circuit 1.8ns @ 5V 50pF 1.1mm 32mA 32mA 1.7V-2V
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User Guide
74LVC1G00SE-7 Details
NAND 74LVC1G00 e3 74LVC logic gate circuit 1.8ns @ 5V 50pF 1.1mm 32mA 32mA 1.7V-2V
74LVC1G00SE-7 Specification Parameters
- Part Status: Active
- RoHS Status: ROHS3 Compliant
- Number of Inputs: 2
- Mount: Surface Mount
- Number of Functions: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Terminal Position: DUAL
- Terminal Form: GULL WING
- REACH SVHC: No SVHC
- Number of Terminations: 5
- Pin Count: 5
- Time@Peak Reflow Temperature-Max (s): 40
- Supply Voltage: 1.8V
- Factory Lead Time: 17 Weeks
- Height: 1.1mm
- Subcategory: Gates
- Width: 2.2mm
- Output Current: 32mA
- Package / Case: 5-TSSOP, SC-70-5, SOT-353
- Series: 74LVC
- Logic Type: NAND Gate
- Logic Function: NAND
- Logic Level - High: 1.7V ~ 2V
- Propagation Delay: 1.8 ns
- Max Propagation Delay @ V, Max CL: 1.8ns @ 5V, 50pF
- Schmitt Trigger: NO
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Gates: 1
- Radiation Hardening: No
- Lead Free: Lead Free
- Power Supplies: 3.3V
- Technology: CMOS
- Peak Reflow Temperature (Cel): 260
- Number of Pins: 5
- Terminal Finish: Matte Tin (Sn)
- Published: 2010
- Operating Temperature: -40°C~125°C
- Packing Method: TAPE AND REEL
- Output Voltage: 6.5V
- Length: 2.2mm
- Quiescent Current: 200μA
- Family: LVC/LCX/Z
- Voltage - Supply: 1.65V~5.5V
- Prop. Delay@Nom-Sup: 6 ns
- Current - Output High, Low: 32mA 32mA
- Logic Level - Low: 0.7V ~ 0.8V
- Turn On Delay Time: 3.4 ns
- Base Part Number: 74LVC1G00
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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