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- Manufacturer No：DMG4407SSS-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMG4407SSS-13
- SKU：1783967
- Description：Trans MOSFET P-CH 30V 9.9A 8-Pin SO T/R
User Guide
User Guide
DMG4407SSS-13 Details
Trans MOSFET P-CH 30V 9.9A 8-Pin SO T/R
DMG4407SSS-13 Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- Published: 2013
- REACH SVHC: No SVHC
- Terminal Finish: Matte Tin (Sn)
- Factory Lead Time: 7 Weeks
- Transistor Element Material: SILICON
- DS Breakdown Voltage-Min: 30V
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Subcategory: Other Transistors
- FET Type: P-Channel
- Fall Time (Typ): 22 ns
- Turn-Off Delay Time: 38 ns
- Continuous Drain Current (ID): 9.9A
- Weight: 73.992255mg
- Turn On Delay Time: 11.3 ns
- Rds On (Max) @ Id, Vgs: 11m Ω @ 12A, 20V
- Input Capacitance (Ciss) (Max) @ Vds: 2246pF @ 15V
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Part Status: Obsolete
- Number of Terminations: 8
- Terminal Position: DUAL
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Time@Peak Reflow Temperature-Max (s): 40
- Gate to Source Voltage (Vgs): 25V
- Drain to Source Voltage (Vdss): 30V
- Package / Case: 8-SOIC (0.154, 3.90mm Width)
- Transistor Application: SWITCHING
- Additional Feature: HIGH RELIABILITY
- Configuration: SINGLE WITH BUILT-IN DIODE
- Vgs(th) (Max) @ Id: 3V @ 250μA
- Vgs (Max): ±25V
- Drive Voltage (Max Rds On,Min Rds On): 6V 10V
- Operating Temperature: -50°C~150°C TJ
- Rise Time: 15.4 ns
- Gate Charge (Qg) (Max) @ Vgs: 20.5nC @ 10V
- Current - Continuous Drain (Id) @ 25°C: 9.9A Ta
- Power Dissipation-Max: 1.45W Ta
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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