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- Manufacturer No：DMN3020LK3-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN3020LK3-13
- SKU：1793058
- Description：MOSFET N-CH 30V 11.3A DPAK
User Guide
User Guide
DMN3020LK3-13 Details
MOSFET N-CH 30V 11.3A DPAK
DMN3020LK3-13 Specification Parameters
- RoHS Status: ROHS3 Compliant
- Number of Terminations: 2
- Mount: Surface Mount
- Number of Channels: 1
- Radiation Hardening: No
- Part Status: Obsolete
- Number of Pins: 3
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Gate to Source Voltage (Vgs): 12V
- Transistor Element Material: SILICON
- Drain to Source Breakdown Voltage: 30V
- Packaging: Cut Tape (CT)
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- JESD-30 Code: R-PSSO-G2
- Case Connection: DRAIN
- Drive Voltage (Max Rds On,Min Rds On): 4.5V 10V
- Vgs(th) (Max) @ Id: 3V @ 250μA
- JEDEC-95 Code: TO-252AA
- Continuous Drain Current (ID): 11.3A
- Turn On Delay Time: 2.9 ns
- Weight: 3.949996g
- Input Capacitance (Ciss) (Max) @ Vds: 608pF @ 15V
- Power Dissipation-Max: 2.17W Ta
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- JESD-609 Code: e3
- Pin Count: 4
- Pbfree Code: no
- Published: 2012
- Terminal Finish: Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s): 40
- Terminal Position: SINGLE
- Operating Temperature: -55°C~150°C TJ
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Configuration: SINGLE WITH BUILT-IN DIODE
- Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
- Fall Time (Typ): 8 ns
- Turn-Off Delay Time: 16 ns
- Subcategory: FET General Purpose Powers
- Rise Time: 3.3 ns
- Drain-source On Resistance-Max: 0.02Ohm
- Gate Charge (Qg) (Max) @ Vgs: 6.3nC @ 4.5V
- Rds On (Max) @ Id, Vgs: 20m Ω @ 7A, 10V
- Current - Continuous Drain (Id) @ 25°C: 11.3A Ta
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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