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DMN3032LFDB-13123
Inventory:1
  • Qty Unit Price price
  • 1 $0.186 $0.186
  • 10 $0.184 $1.84
  • 100 $0.182 $18.2
  • 1000 $0.18 $180
  • 10000 $0.178 $1780

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DMN3032LFDB-13
  • Manufacturer No:
    DMN3032LFDB-13
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Transistors - FETs, MOSFETs - Arrays
  • Datasheet:
    DMN3032LFDB-13
  • SKU:
    1792530
  • Description:
    MOSFET 2N-CH 30V 6.2A UDFN2020-6

DMN3032LFDB-13 Details

MOSFET 2N-CH 30V 6.2A UDFN2020-6

DMN3032LFDB-13 Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • Number of Terminations: 6
  • Max Power Dissipation: 1W
  • Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
  • FET Feature: Standard
  • DS Breakdown Voltage-Min: 30V
  • Operating Temperature: -55°C~150°C TJ
  • Operating Mode: ENHANCEMENT MODE
  • Factory Lead Time: 23 Weeks
  • FET Technology: METAL-OXIDE SEMICONDUCTOR
  • FET Type: 2 N-Channel (Dual)
  • Continuous Drain Current (ID): 6.2A
  • Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
  • Drain-source On Resistance-Max: 0.03Ohm
  • Gate Charge (Qg) (Max) @ Vgs: 10.6nC @ 10V
  • RoHS Status: ROHS3 Compliant
  • Number of Elements: 2
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • JESD-609 Code: e4
  • Published: 2015
  • Power - Max: 1W
  • Transistor Element Material: SILICON
  • Drain to Source Voltage (Vdss): 30V
  • Terminal Form: NO LEAD
  • Transistor Application: SWITCHING
  • Additional Feature: HIGH RELIABILITY
  • Case Connection: DRAIN
  • Reference Standard: AEC-Q101
  • Vgs(th) (Max) @ Id: 2V @ 250μA
  • JESD-30 Code: S-PDSO-N6
  • Package / Case: 6-UDFN Exposed Pad
  • Input Capacitance (Ciss) (Max) @ Vds: 500pF @ 15V
  • Rds On (Max) @ Id, Vgs: 30m Ω @ 5.8A, 10V

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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