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- Manufacturer No：DMN3065LW-13
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：DMN3065LW-13
- SKU：1722225
- Description：MOSFET N-CH 30V 4A SOT323
User Guide
User Guide
DMN3065LW-13 Details
MOSFET N-CH 30V 4A SOT323
DMN3065LW-13 Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Terminal Position: DUAL
- Terminal Form: GULL WING
- Gate to Source Voltage (Vgs): 12V
- Transistor Element Material: SILICON
- Drain to Source Breakdown Voltage: 30V
- Factory Lead Time: 22 Weeks
- Continuous Drain Current (ID): 4A
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Package / Case: SC-70, SOT-323
- Fall Time (Typ): 2 ns
- Vgs(th) (Max) @ Id: 1.5V @ 250μA
- Drive Voltage (Max Rds On,Min Rds On): 2.5V 10V
- Turn-Off Delay Time: 10.3 ns
- Drain-source On Resistance-Max: 0.052Ohm
- Gate Charge (Qg) (Max) @ Vgs: 11.7nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 465pF @ 15V
- Base Part Number: DMN3065
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- JESD-609 Code: e3
- Number of Terminations: 3
- Terminal Finish: Matte Tin (Sn)
- Published: 2014
- Element Configuration: Single
- Operating Temperature: -55°C~150°C TJ
- Drain Current-Max (Abs) (ID): 4A
- FET Type: N-Channel
- Transistor Application: SWITCHING
- JESD-30 Code: R-PDSO-G3
- Weight: 6.010099mg
- Vgs (Max): ±12V
- Turn On Delay Time: 1.9 ns
- Current - Continuous Drain (Id) @ 25°C: 4A Ta
- Rise Time: 1.6ns
- Power Dissipation-Max: 770mW Ta
- Rds On (Max) @ Id, Vgs: 52m Ω @ 4A, 10V
- Capacitance: 465pF
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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