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MMBZ5226BW-7123
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MMBZ5226BW-7
  • Manufacturer No:
    MMBZ5226BW-7
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    MMBZ5226BW-7
  • SKU:
    1763764
  • Description:
    DIODE ZENER 3.3V 200MW SOT323

MMBZ5226BW-7 Details

DIODE ZENER 3.3V 200MW SOT323

MMBZ5226BW-7 Specification Parameters

  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Number of Elements: 1
  • RoHS Status: Non-RoHS Compliant
  • Reference Voltage: 3.3V
  • Voltage - Rated DC: 3.3V
  • Number of Pins: 3
  • Pbfree Code: no
  • Qualification Status: Not Qualified
  • JESD-609 Code: e0
  • Termination: SMD/SMT
  • Time@Peak Reflow Temperature-Max (s): 10
  • Published: 2006
  • Element Configuration: Single
  • Height: 1mm
  • Test Current: 20mA
  • Power Rating: 200mW
  • Power Dissipation: 200mW
  • Polarity: UNIDIRECTIONAL
  • HTS Code: 8541.10.00.50
  • Subcategory: Voltage Reference Diodes
  • Length: 2.2mm
  • Width: 1.35mm
  • Peak Reverse Current: 25μA
  • Impedance-Max: 28Ohm
  • Current - Reverse Leakage @ Vr: 25μA @ 1V
  • Base Part Number: MMBZ5226B
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • ECCN Code: EAR99
  • Terminal Position: DUAL
  • Zener Voltage: 3.3V
  • Number of Terminations: 3
  • Pin Count: 3
  • Lead Free: Contains Lead
  • Tolerance: ±5%
  • Terminal Form: GULL WING
  • Reach Compliance Code: unknown
  • Voltage Tolerance: 5%
  • Diode Element Material: SILICON
  • Operating Temperature: -65°C~150°C
  • Part Status: Discontinued
  • Zener Current: 20mA
  • Max Power Dissipation: 200mW
  • Terminal Finish: TIN LEAD
  • Diode Type: ZENER DIODE
  • Technology: ZENER
  • Peak Reflow Temperature (Cel): 235
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Package / Case: SC-70, SOT-323
  • Weight: 6.010099mg
  • Impedance: 28Ohm
  • Voltage Tol-Max: 4.99%

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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