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MMBZ5227BT-7-F123
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MMBZ5227BT-7-F
  • Manufacturer No:
    MMBZ5227BT-7-F
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    MMBZ5227BT-7-F
  • SKU:
    1755333
  • Description:
    DIODE ZENER 3.6V 150MW SOT523

MMBZ5227BT-7-F Details

DIODE ZENER 3.6V 150MW SOT523

MMBZ5227BT-7-F Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • Number of Elements: 1
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Factory Lead Time: 6 Weeks
  • Number of Pins: 3
  • Tolerance: ±5%
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 40
  • Voltage Tolerance: 5%
  • Width: 1.6mm
  • Diode Element Material: SILICON
  • Operating Temperature: -65°C~150°C
  • Zener Voltage: 3.6V
  • Polarity: UNIDIRECTIONAL
  • HTS Code: 8541.10.00.50
  • Weight: 2.012816mg
  • Power Rating: 150mW
  • Subcategory: Voltage Reference Diodes
  • Max Reverse Leakage Current: 15μA
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Forward Voltage: 900mV
  • Current - Reverse Leakage @ Vr: 15μA @ 1V
  • Impedance-Max: 24 Ω
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Terminal Position: DUAL
  • Number of Terminations: 3
  • Pin Count: 3
  • Terminal Form: GULL WING
  • Terminal Finish: Matte Tin (Sn)
  • Voltage Tol-Max: 5%
  • Published: 2007
  • Length: 1.6mm
  • Element Configuration: Single
  • Reference Voltage: 3.6V
  • Test Current: 20mA
  • Diode Type: ZENER DIODE
  • Technology: ZENER
  • Max Power Dissipation: 150mW
  • Power Dissipation: 150mW
  • Peak Reverse Current: 15μA
  • Zener Current: 15μA
  • Height: 750μm
  • Package / Case: SOT-523
  • Impedance: 24 Ω
  • Base Part Number: MMBZ5227B

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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