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QZX363C12-7-F123
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QZX363C12-7-F
  • Manufacturer No:
    QZX363C12-7-F
  • Manufacturer:
    Diodes Incorporated
  • Category:
    Diodes - Zener - Arrays
  • Datasheet:
    QZX363C12-7-F
  • SKU:
    1757080
  • Description:
    DIODE ZENER ARRAY 12V SOT363

QZX363C12-7-F Details

DIODE ZENER ARRAY 12V SOT363

QZX363C12-7-F Specification Parameters

  • Part Status: Active
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Radiation Hardening: No
  • Terminal Position: DUAL
  • Tolerance: ±5%
  • Number of Pins: 6
  • Terminal Form: GULL WING
  • Peak Reflow Temperature (Cel): 260
  • Reference Voltage: 12V
  • Time@Peak Reflow Temperature-Max (s): 40
  • Published: 2008
  • Operating Temperature: -65°C~150°C
  • Factory Lead Time: 24 Weeks
  • Max Power Dissipation: 200mW
  • Polarity: UNIDIRECTIONAL
  • Zener Current: 5mA
  • HTS Code: 8541.10.00.50
  • Subcategory: Voltage Reference Diodes
  • Peak Reverse Current: 100nA
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Width: 1.35mm
  • Impedance-Max: 25Ohm
  • Weight: 6.010099mg
  • Configuration: 2 Pair Common Anode
  • RoHS Status: ROHS3 Compliant
  • Mounting Type: Surface Mount
  • Packaging: Tape & Reel (TR)
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Number of Elements: 4
  • Number of Terminations: 6
  • Pin Count: 6
  • Termination: SMD/SMT
  • Terminal Finish: Matte Tin (Sn)
  • Zener Voltage: 12V
  • Voltage Tolerance: 5%
  • Diode Element Material: SILICON
  • Height: 1mm
  • Power Rating: 200mW
  • Power Dissipation: 200mW
  • Test Current: 5mA
  • Diode Type: ZENER DIODE
  • Technology: ZENER
  • Max Reverse Leakage Current: 100nA
  • Length: 2.2mm
  • Element Configuration: Common Anode
  • Package / Case: 6-TSSOP, SC-88, SOT-363
  • Impedance: 25Ohm
  • Current - Reverse Leakage @ Vr: 100nA @ 8V
  • Voltage Tol-Max: 5.39%

Diodes Incorporated — Manufacturer Introduction

Diodes Incorporated
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.

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