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- Manufacturer No：ZVP2120ASTZ
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZVP2120ASTZ
- SKU：1830675
- Description：MOSFET P-Chnl 200V
User Guide
User Guide
ZVP2120ASTZ Details
MOSFET P-Chnl 200V
ZVP2120ASTZ Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Through Hole
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Terminations: 3
- Pin Count: 3
- REACH SVHC: No SVHC
- Drain to Source Voltage (Vdss): 200V
- Terminal Finish: Matte Tin (Sn)
- Drive Voltage (Max Rds On,Min Rds On): 10V
- Element Configuration: Single
- Packaging: Tape & Box (TB)
- Operating Temperature: -55°C~150°C TJ
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Width: 2.41mm
- Rise Time: 15ns
- Turn-Off Delay Time: 12 ns
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Power Dissipation: 700mW
- Length: 4.77mm
- Current Rating: -120mA
- Voltage - Rated DC: -200V
- Input Capacitance (Ciss) (Max) @ Vds: 100pF @ 25V
- Rds On (Max) @ Id, Vgs: 25 Ω @ 150mA, 10V
- RoHS Status: ROHS3 Compliant
- Mounting Type: Through Hole
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Pins: 3
- Factory Lead Time: 10 Weeks
- Peak Reflow Temperature (Cel): 260
- Terminal Form: WIRE
- Time@Peak Reflow Temperature-Max (s): 40
- Transistor Element Material: SILICON
- Gate to Source Voltage (Vgs): 20V
- Published: 2001
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Continuous Drain Current (ID): 120mA
- Fall Time (Typ): 15 ns
- FET Type: P-Channel
- Weight: 453.59237mg
- Turn On Delay Time: 7 ns
- Height: 4.01mm
- Power Dissipation-Max: 700mW Ta
- Drain to Source Breakdown Voltage: -200V
- Vgs(th) (Max) @ Id: 3.5V @ 1mA
- Current - Continuous Drain (Id) @ 25°C: 120mA Ta
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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