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- Manufacturer No：ZXM62P03E6TC
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZXM62P03E6TC
- SKU：1827574
- Description：MOSFET P-CH 30V 1.5A SOT23-6
User Guide
User Guide
ZXM62P03E6TC Details
MOSFET P-CH 30V 1.5A SOT23-6
ZXM62P03E6TC Specification Parameters
- RoHS Status: ROHS3 Compliant
- Mounting Type: Surface Mount
- Packaging: Tape & Reel (TR)
- Number of Channels: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Terminal Position: DUAL
- Number of Pins: 6
- Terminal Form: GULL WING
- Terminal Finish: Matte Tin (Sn)
- Time@Peak Reflow Temperature-Max (s): 40
- Transistor Element Material: SILICON
- Operating Temperature: -55°C~150°C TJ
- Technology: MOSFET (Metal Oxide)
- Transistor Application: SWITCHING
- Vgs (Max): ±20V
- Width: 1.8mm
- Package / Case: SOT-23-6
- FET Type: P-Channel
- Drain to Source Breakdown Voltage: -30V
- Fall Time (Typ): 6.4 ns
- Current - Continuous Drain (Id) @ 25°C: 1.5A Ta
- Input Capacitance (Ciss) (Max) @ Vds: 330pF @ 25V
- Turn-Off Delay Time: 13.9 ns
- Gate Charge (Qg) (Max) @ Vgs: 10.2nC @ 10V
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- Radiation Hardening: No
- Part Status: Obsolete
- Number of Terminations: 6
- Pin Count: 6
- Peak Reflow Temperature (Cel): 260
- Gate to Source Voltage (Vgs): 12V
- Published: 2006
- Drain to Source Voltage (Vdss): 30V
- Continuous Drain Current (ID): 1.5A
- Height: 1.3mm
- Operating Mode: ENHANCEMENT MODE
- Length: 3.1mm
- Configuration: SINGLE WITH BUILT-IN DIODE
- Drive Voltage (Max Rds On,Min Rds On): 4.5V 10V
- Power Dissipation: 625mW
- Vgs(th) (Max) @ Id: 1V @ 250μA
- Turn On Delay Time: 2.8 ns
- Power Dissipation-Max: 625mW Ta
- Weight: 14.996898mg
- Rise Time: 6.4ns
- Rds On (Max) @ Id, Vgs: 230m Ω @ 800mA, 4.5V
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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