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- Manufacturer No：ZXMNS3BM832TA
- Manufacturer：Diodes Incorporated
- Category：Transistors - FETs, MOSFETs - Single
- Datasheet：ZXMNS3BM832TA
- SKU：1765040
- Description：MOSFET N-CH 30V 2A 8-MLP
User Guide
User Guide
ZXMNS3BM832TA Details
MOSFET N-CH 30V 2A 8-MLP
ZXMNS3BM832TA Specification Parameters
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Surface Mount
- RoHS Status: RoHS Compliant
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Pins: 8
- Peak Reflow Temperature (Cel): 260
- Gate to Source Voltage (Vgs): 12V
- Transistor Element Material: SILICON
- Voltage - Rated DC: 30V
- Power Dissipation: 3W
- Operating Temperature: -55°C~150°C TJ
- Packaging: Cut Tape (CT)
- FET Type: N-Channel
- Transistor Application: SWITCHING
- Configuration: SINGLE WITH BUILT-IN DIODE
- Rise Time: 1.5ns
- Vgs (Max): ±12V
- Turn-Off Delay Time: 5.1 ns
- Power Dissipation-Max: 1W Ta
- FET Feature: Schottky Diode (Isolated)
- Vgs(th) (Max) @ Id: 700mV @ 250μA
- Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
- Rds On (Max) @ Id, Vgs: 180m Ω @ 1.5A, 4.5V
- Mounting Type: Surface Mount
- Number of Elements: 1
- ECCN Code: EAR99
- JESD-609 Code: e3
- Part Status: Obsolete
- Pin Count: 8
- Number of Terminations: 10
- Time@Peak Reflow Temperature-Max (s): 40
- Terminal Position: QUAD
- Drain to Source Breakdown Voltage: 30V
- Published: 2002
- Terminal Finish: MATTE TIN
- Terminal Form: FLAT
- Technology: MOSFET (Metal Oxide)
- Operating Mode: ENHANCEMENT MODE
- Current Rating: 2.7A
- Package / Case: 8-VDFN Exposed Pad
- Drive Voltage (Max Rds On,Min Rds On): 2.5V 4.5V
- Turn On Delay Time: 1.1 ns
- Fall Time (Typ): 2.1 ns
- Current - Continuous Drain (Id) @ 25°C: 2A Ta
- Continuous Drain Current (ID): 2.72A
- JESD-30 Code: R-PQFP-F10
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Diodes Incorporated — Manufacturer Introduction
Diodes Incorporated delivers high-quality semiconductor products to the world’s leading companies in the consumer electronics, computing, communications, industrial, and automotive markets. They leverage their expanded product portfolio of discrete, analog, and mixed-signal products and leading-edge packaging technology to meet customers’ needs. Their broad range of application-specific solutions and solutions-focused sales, coupled with worldwide operations of 25 sites, including engineering, testing, manufacturing, and customer service, enables us to be a premier provider for high-volume, high-growth markets.
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