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- Manufacturer No：MC9S12DP256BCPV
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microcontrollers
- Datasheet：MC9S12DP256BCPV
- SKU：10903625
- Description：
User Guide
User Guide
MC9S12DP256BCPV Details
MC9S12DP256BCPV Specification Parameters
- DMA Channels: NO
- Number of Timers/Counters: 1
- RoHS Status: Non-RoHS Compliant
- Has ADC: YES
- Operating Supply Voltage: 5V
- Qualification Status: Not Qualified
- JESD-609 Code: e0
- Terminal Form: GULL WING
- Max Operating Temperature: 85°C
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Finish: Tin/Lead (Sn/Pb)
- Temperature Grade: INDUSTRIAL
- Address Bus Width: 19
- Frequency (Max): 25MHz
- Subcategory: Microcontrollers
- uPs/uCs/Peripheral ICs Type: MICROCONTROLLER
- Data Bus Width: 16b
- Peak Reflow Temperature (Cel): 220
- Number of Terminations: 112
- Memory Size: 256kB
- Number of I/O: 91
- RAM Size: 12kB
- Interface: CAN, I2C, SCI, SPI
- DAC Channels: NO
- ECCN Code: EAR99
- Surface Mount: YES
- PWM Channels: YES
- Moisture Sensitivity Level (MSL): 3
- Min Operating Temperature: -40°C
- Bit Size: 16
- Technology: CMOS
- Supply Voltage: 2.5V
- Reach Compliance Code: not_compliant
- Terminal Position: QUAD
- Terminal Pitch: 0.65mm
- Min Supply Voltage: 4.5V
- Length: 20mm
- Max Supply Voltage: 5.25V
- Supply Current-Max: 65mA
- Number of Programmable I/O: 49
- Package / Case: LQFP
- Pin Count: 112
- Halogen Free: Not Halogen Free
- Core Architecture: HCS12
- Additional Feature: ALSO REQUIRES 5V SUPPLY
- Memory Type: EEPROM, FLASH
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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