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- Manufacturer No：S912XDP512F0CAGR
- Manufacturer：Freescale Semiconductor, Inc. (NXP Semiconductors)
- Category：Embedded - Microcontrollers
- Datasheet：S912XDP512F0CAGR
- SKU：10863962
- Description：
User Guide
User Guide
S912XDP512F0CAGR Details
S912XDP512F0CAGR Specification Parameters
- DAC Channels: NO
- RoHS Status: Non-RoHS Compliant
- Has ADC: YES
- DMA Channels: YES
- Moisture Sensitivity Level (MSL): 3
- Operating Temperature (Min): -40°C
- External Data Bus Width: 16
- Technology: CMOS
- Operating Temperature (Max): 85°C
- Terminal Finish: Matte Tin (Sn)
- Height Seated (Max): 1.6mm
- Terminal Position: QUAD
- Temperature Grade: INDUSTRIAL
- Length: 20mm
- Subcategory: Microcontrollers
- uPs/uCs/Peripheral ICs Type: MICROCONTROLLER
- Screening Level: AEC-Q100
- Pin Count: 144
- ECCN Code: 3A991.A.2
- Speed: 40 MHz
- RAM (bytes): 32768
- Supply Voltage-Min (Vsup): 2.35V
- ROM (words): 524288
- Additional Feature: ALSO REQUIRES 5V SUPPLY
- Pbfree Code: yes
- Surface Mount: YES
- PWM Channels: YES
- JESD-609 Code: e3
- Qualification Status: Not Qualified
- Bit Size: 16
- Terminal Form: GULL WING
- Peak Reflow Temperature (Cel): 260
- Supply Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 40
- Terminal Pitch: 0.5mm
- ROM Programmability: FLASH
- Address Bus Width: 23
- Width: 20mm
- HTS Code: 8542.31.00.01
- Clock Frequency: 16MHz
- Number of Terminations: 144
- Supply Current-Max: 110mA
- Supply Voltage-Max (Vsup): 2.75V
- Power Supplies: 2.55V
- Number of I/O: 119
- JESD-30 Code: S-PQFP-G144
- CPU Family: CPU12
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Freescale Semiconductor, Inc. (NXP Semiconductors) — Manufacturer Introduction
Freescale Semiconductor is now NXP Semiconductor. Freescale semiconductor was a global leader in embedded processing solutions. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – their technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of their key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices.
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