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  • Manufacturer No:
    EPF10K30ETC144-2
  • Manufacturer:
    Intel / Altera
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    EPF10K30ETC144-2
  • SKU:
    5973485
  • Description:
    Contains Lead MIXED CMOS COMMERCIAL FPGA 70C 10mA 1.5kB 0.4ns

EPF10K30ETC144-2 Details

Contains Lead MIXED CMOS COMMERCIAL FPGA 70C 10mA 1.5kB 0.4ns

EPF10K30ETC144-2 Specification Parameters

  • Mount: Surface Mount
  • Moisture Sensitivity Level (MSL): 3
  • Pbfree Code: no
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Supply Voltage: 2.5V
  • Max Operating Temperature: 70°C
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Terminal Pitch: 0.5mm
  • HTS Code: 8542.39.00.01
  • Min Operating Temperature: 0°C
  • Length: 20mm
  • Frequency: 200MHz
  • Published: 1998
  • Number of Pins: 144
  • Min Supply Voltage: 2.375V
  • Peak Reflow Temperature (Cel): 220
  • ECCN Code: 3A991
  • Number of Outputs: 102
  • Number of Logic Blocks (LABs): 216
  • Output Function: MIXED
  • Memory Size: 1.5kB
  • Number of Circuits: 1728
  • RoHS Status: RoHS Compliant
  • Temperature Grade: COMMERCIAL
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Technology: CMOS
  • Operating Supply Voltage: 2.5V
  • Time@Peak Reflow Temperature-Max (s): 30
  • Height Seated (Max): 1.6mm
  • Terminal Position: QUAD
  • Part Status: Discontinued
  • Operating Supply Current: 10mA
  • Width: 20mm
  • Subcategory: Field Programmable Gate Arrays
  • Number of Terminations: 144
  • Pin Count: 144
  • Max Supply Voltage: 2.625V
  • Package / Case: TQFP
  • Number of I/O: 102
  • Programmable Logic Type: LOADABLE PLD
  • Power Supplies: 2.52.5/3.3V
  • Propagation Delay: 0.4 ns
  • RAM Size: 3kB
  • Number of Gates: 119000

Intel / Altera — Manufacturer Introduction

Intel enables designers of electronic systems to rapidly and cost effectively innovate, differentiate, and win in their markets. Intel offers FPGAs, SoCs, CPLDs, and Power Solutions, to provide high-value solutions to customers worldwide.

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