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HIN207ECB-T123
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HIN207ECB-T
  • Manufacturer No:
    HIN207ECB-T
  • Manufacturer:
    Intersil (Renesas Electronics America)
  • Category:
    Interface - Drivers, Receivers, Transceivers
  • Datasheet:
    HIN207ECB-T
  • SKU:
    11055914
  • Description:
    Non-RoHS Compliant SCHMITT TRIGGER GULL WING 2000 (Type) 70C 5V 230kbps 10000ns

HIN207ECB-T Details

Non-RoHS Compliant SCHMITT TRIGGER GULL WING 2000 (Type) 70C 5V 230kbps 10000ns

HIN207ECB-T Specification Parameters

  • Differential Output: NO
  • Moisture Sensitivity Level (MSL): 1
  • RoHS Status: Non-RoHS Compliant
  • Terminal Position: DUAL
  • Power Supplies: 5V
  • Receiver Number of Bits: 3
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Technology: CMOS
  • Operating Temperature (Max): 70°C
  • Number of Terminations: 24
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • HTS Code: 8542.39.00.01
  • Supply Current-Max: 20mA
  • Peak Reflow Temperature (Cel): 240
  • Supply Voltage-Max (Vsup): 5.25V
  • Package / Case: SOIC
  • Subcategory: Line Driver or Receivers
  • Out Swing-Min: 10 V
  • JESD-30 Code: R-PDSO-G24
  • Output Low Current-Max: 0.0016A
  • Transmit Delay-Max: 10000 ns
  • Data Rate: 230 kbps
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Supply Voltage: 5V
  • Number of Functions: 3
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Driver Number of Bits: 5
  • Reach Compliance Code: not_compliant
  • Pin Count: 24
  • Terminal Pitch: 1.27mm
  • Part Status: Discontinued
  • Published: 2000
  • Width: 7.5mm
  • Supply Voltage-Min (Vsup): 4.75V
  • Height Seated (Max): 2.65mm
  • Input Characteristics: SCHMITT TRIGGER
  • Length: 15.4mm
  • Interface IC Type: LINE TRANSCEIVER
  • Receive Delay-Max: 10000 ns
  • Interface Standard: EIA-232-E; V.28

Intersil (Renesas Electronics America) — Manufacturer Introduction

Intersil (Renesas Electronics America)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs. The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect. Join Renesas as it strengthens its leading position in the global semiconductor market.

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