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HSP50210JC-52Z123
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HSP50210JC-52Z
  • Manufacturer No:
    HSP50210JC-52Z
  • Manufacturer:
    Intersil (Renesas Electronics America)
  • Category:
    RF Misc ICs and Modules
  • Datasheet:
    HSP50210JC-52Z
  • SKU:
    11008289
  • Description:
    PLCC 1 84 TELECOM CIRCUIT RF IC 29.31mm 5.25V 52MHz 500muA

HSP50210JC-52Z Details

PLCC 1 84 TELECOM CIRCUIT RF IC 29.31mm 5.25V 52MHz 500muA

HSP50210JC-52Z Specification Parameters

  • Part Status: Active
  • RoHS Status: RoHS Compliant
  • JESD-609 Code: e3
  • Supply Voltage: 5V
  • Power Supplies: 5V
  • Temperature Grade: COMMERCIAL
  • Max Operating Temperature: 70°C
  • Terminal Position: QUAD
  • Min Operating Temperature: 0°C
  • Published: 2000
  • Terminal Finish: Matte Tin (Sn) - annealed
  • Peak Reflow Temperature (Cel): 245
  • Number of Terminations: 84
  • Pin Count: 84
  • Telecom IC Type: TELECOM CIRCUIT
  • Subcategory: Other Telecom ICs
  • Length: 29.31mm
  • Supply Current-Max: 0.225mA
  • Number of Functions: 1
  • Surface Mount: YES
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Operating Supply Voltage: 5V
  • Moisture Sensitivity Level (MSL): 4
  • Qualification Status: Not Qualified
  • Terminal Pitch: 1.27mm
  • HTS Code: 8542.39.00.01
  • Terminal Form: J BEND
  • Height Seated (Max): 4.57mm
  • Max Supply Voltage: 5.25V
  • Min Supply Voltage: 4.75V
  • Number of Pins: 84
  • Operating Supply Current: 500μA
  • Package / Case: PLCC
  • Frequency: 52MHz
  • Width: 29.31mm

Intersil (Renesas Electronics America) — Manufacturer Introduction

Intersil (Renesas Electronics America)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs. The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect. Join Renesas as it strengthens its leading position in the global semiconductor market.

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