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ISL32275EIVZ123
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ISL32275EIVZ
  • Manufacturer No:
    ISL32275EIVZ
  • Manufacturer:
    Intersil (Renesas Electronics America)
  • Category:
    Interface - Drivers, Receivers, Transceivers
  • Datasheet:
    ISL32275EIVZ
  • SKU:
    11058875
  • Description:
    RoHS Compliant GULL WING 2003 BICMOS (Type) 85C 20Mbps 5mm 5.5mA

ISL32275EIVZ Details

RoHS Compliant GULL WING 2003 BICMOS (Type) 85C 20Mbps 5mm 5.5mA

ISL32275EIVZ Specification Parameters

  • Part Status: Active
  • Mount: Surface Mount
  • RoHS Status: RoHS Compliant
  • Radiation Hardening: No
  • Terminal Position: DUAL
  • Number of Receivers: 4
  • Number of Pins: 16
  • Pin Count: 16
  • Peak Reflow Temperature (Cel): 260
  • Time@Peak Reflow Temperature-Max (s): 30
  • Length: 5mm
  • Terminal Pitch: 0.65mm
  • Published: 2003
  • Terminal Finish: Matte Tin (Sn) - annealed
  • Package / Case: TSSOP
  • Telecom IC Type: TELECOM CIRCUIT
  • Moisture Sensitivity Level (MSL): 2
  • Number of Functions: 1
  • Pbfree Code: yes
  • JESD-609 Code: e3
  • Supply Voltage: 5V
  • Min Operating Temperature: -40°C
  • Number of Terminations: 16
  • Terminal Form: GULL WING
  • Max Operating Temperature: 85°C
  • Operating Supply Voltage: 5.5V
  • Temperature Grade: INDUSTRIAL
  • Technology: BICMOS
  • Height Seated (Max): 1.2mm
  • Nominal Supply Current: 5.5mA
  • Logic Function: Receiver
  • Data Rate: 20 Mbps

Intersil (Renesas Electronics America) — Manufacturer Introduction

Intersil (Renesas Electronics America)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs. The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect. Join Renesas as it strengthens its leading position in the global semiconductor market.

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