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ISL8485ECB-T123
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ISL8485ECB-T
  • Manufacturer No:
    ISL8485ECB-T
  • Manufacturer:
    Intersil (Renesas Electronics America)
  • Category:
    Interface - Drivers, Receivers, Transceivers
  • Datasheet:
    ISL8485ECB-T
  • SKU:
    11033836
  • Description:
    RoHS Compliant DIFFERENTIAL SCHMITT TRIGGER GULL WING 2003 (Type) 70C 5V 5Mbps 150ns

ISL8485ECB-T Details

RoHS Compliant DIFFERENTIAL SCHMITT TRIGGER GULL WING 2003 (Type) 70C 5V 5Mbps 150ns

ISL8485ECB-T Specification Parameters

  • Mount: Surface Mount
  • Moisture Sensitivity Level (MSL): 1
  • Receiver Number of Bits: 1
  • ECCN Code: EAR99
  • Number of Terminations: 8
  • Terminal Position: DUAL
  • Power Supplies: 5V
  • Lead Free: Contains Lead
  • JESD-609 Code: e0
  • Technology: CMOS
  • Time@Peak Reflow Temperature-Max (s): 30
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • HTS Code: 8542.39.00.01
  • Supply Voltage-Min (Vsup): 4.5V
  • Peak Reflow Temperature (Cel): 240
  • Height Seated (Max): 1.75mm
  • JESD-30 Code: R-PDSO-G8
  • Subcategory: Line Driver or Receivers
  • Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER
  • Interface IC Type: LINE TRANSCEIVER
  • Out Swing-Min: 1.5 V
  • High Level Input Current-Max: 0.000002A
  • Data Rate: 5 Mbps
  • Number of Functions: 1
  • Driver Number of Bits: 1
  • RoHS Status: RoHS Compliant
  • Differential Output: YES
  • Pin Count: 8
  • Supply Voltage: 5V
  • Temperature Grade: COMMERCIAL
  • Qualification Status: Not Qualified
  • Terminal Form: GULL WING
  • Operating Temperature (Max): 70°C
  • Supply Voltage-Max (Vsup): 5.5V
  • Terminal Pitch: 1.27mm
  • Part Status: Discontinued
  • Published: 2003
  • Width: 3.9mm
  • Length: 4.9mm
  • Package / Case: SOIC
  • Transmit Delay-Max: 50 ns
  • Receive Delay-Max: 150 ns
  • Output Low Current-Max: 0.004A
  • Interface Standard: EIA-422; EIA-485
  • Supply Current-Max: 0.9mA

Intersil (Renesas Electronics America) — Manufacturer Introduction

Intersil (Renesas Electronics America)
Effective January 1, 2018, Renesas and Intersil will operate as one unified enterprise, bringing about a significant expansion to the intrinsic capabilities of semiconductors. This combination unites the widely acclaimed Renesas MCU and SoC technologies with Intersil’s market-leading expertise in high performance power management and precision analog devices. In turn, this brings organic growth in the automotive, industrial and broad-based sectors, allowing the new enterprise to respond with greater speed to customers’ systems needs. The union of Renesas with Intersil began with the completion of the acquisition on February 24, 2017, and the unified “One Global Renesas” went into operation across all markets the following July — bringing together the strengths of both organizations in anticipation of customer requirements in a rapidly changing market environment. This truly global organization offers a vast synergistic effect. Join Renesas as it strengthens its leading position in the global semiconductor market.

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