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TH58BVG3S0HTA00123
  • Manufacturer No:
    TH58BVG3S0HTA00
  • Manufacturer:
  • Category:
    Memory
  • Datasheet:
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  • SKU:
    10416268
  • Description:
    R-PDSO-G48 Surface Mount Tray 1GX8 ic memory 25ns 12mm 8589934592bit 2.7V
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TH58BVG3S0HTA00
  • Manufacturer No:
    TH58BVG3S0HTA00
  • Manufacturer:
    Kioxia America, Inc.
  • Category:
    Memory
  • Datasheet:
    TH58BVG3S0HTA00
  • SKU:
    10416268
  • Description:
    R-PDSO-G48 Surface Mount Tray 1GX8 ic memory 25ns 12mm 8589934592bit 2.7V

TH58BVG3S0HTA00 Details

R-PDSO-G48 Surface Mount Tray 1GX8 ic memory 25ns 12mm 8589934592bit 2.7V

TH58BVG3S0HTA00 Specification Parameters

  • Part Status: Active
  • Number of Functions: 1
  • Surface Mount: YES
  • Terminal Position: DUAL
  • Programming Voltage: 3.3V
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Memory Format: FLASH
  • Supply Voltage-Max (Vsup): 3.6V
  • Memory Interface: Parallel
  • Operating Temperature: 0°C~70°C TA
  • Width: 12mm
  • Operating Mode: ASYNCHRONOUS
  • Length: 18.4mm
  • JESD-30 Code: R-PDSO-G48
  • Memory Density: 8589934592 bit
  • Organization: 1GX8
  • Mounting Type: Surface Mount
  • RoHS Status: RoHS Compliant
  • Memory Width: 8
  • Supply Voltage: 3.3V
  • Packaging: Tray
  • Terminal Pitch: 0.5mm
  • Number of Terminations: 48
  • Supply Voltage-Min (Vsup): 2.7V
  • Height Seated (Max): 1.2mm
  • Memory Type: Non-Volatile
  • Voltage - Supply: 2.7V~3.6V
  • Write Cycle Time - Word, Page: 25ns
  • Technology: FLASH - NAND (SLC)
  • Package / Case: 48-TFSOP (0.724, 18.40mm Width)
  • Memory Size: 8Gb 1G x 8
  • Series: Benand?

Kioxia America, Inc. — Manufacturer Introduction

Kioxia America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the US-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH? 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH?, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

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