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- Manufacturer No：LC5512MB-75F256C
- Manufacturer：Lattice Semiconductor
- Category：Embedded - CPLDs (Complex Programmable Logic Devices)
- Datasheet：LC5512MB-75F256C
- SKU：2729218
- Description：YES 256-BGA 2000 LC5512 complex programmable logic device 275MHz 33mA 17mm 7.5ns
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LC5512MB-75F256C Details
YES 256-BGA 2000 LC5512 complex programmable logic device 275MHz 33mA 17mm 7.5ns
LC5512MB-75F256C Specification Parameters
- Mounting Type: Surface Mount
- ECCN Code: EAR99
- JTAG BST: YES
- Lead Free: Lead Free
- Packaging: Tray
- Qualification Status: Not Qualified
- Number of Logic Elements/Cells: 16
- Supply Voltage: 2.5V
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Reach Compliance Code: not_compliant
- HTS Code: 8542.39.00.01
- Max Supply Voltage: 2.7V
- Operating Supply Current: 33mA
- Published: 2000
- Pin Count: 256
- Min Supply Voltage: 2.3V
- Length: 17mm
- Output Function: MACROCELL
- Height Seated (Max): 2.1mm
- Number of Macro Cells: 512
- Propagation Delay: 9.5 ns
- Delay Time tpd(1) Max: 7.5ns
- JESD-30 Code: S-PBGA-B256
- Number of I/O: 193
- Memory Type: EEPROM, SRAM
- Series: ispXPLD? 5000MB
- Mount: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Additional Feature: YES
- Part Status: Obsolete
- Pbfree Code: no
- JESD-609 Code: e0
- Technology: CMOS
- Operating Supply Voltage: 2.5V
- Time@Peak Reflow Temperature-Max (s): 30
- Terminal Pitch: 1mm
- Terminal Position: BOTTOM
- Nominal Supply Current: 33mA
- Terminal Form: BALL
- Number of Terminations: 256
- Peak Reflow Temperature (Cel): 225
- Terminal Finish: Tin/Lead (Sn63Pb37)
- Width: 17mm
- Subcategory: Programmable Logic Devices
- Number of Programmable I/O: 176
- Programmable Type: In System Programmable
- Voltage Supply - Internal: 2.3V~2.7V
- Package / Case: 256-BGA
- Operating Temperature: 0°C~90°C TJ
- Max Frequency: 275MHz
- Base Part Number: LC5512
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Lattice Semiconductor — Manufacturer Introduction
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.
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