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LFXP3C-3TN144C123
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LFXP3C-3TN144C
  • Manufacturer No:
    LFXP3C-3TN144C
  • Manufacturer:
    Lattice Semiconductor
  • Category:
    Embedded - FPGAs (Field Programmable Gate Array)
  • Datasheet:
    LFXP3C-3TN144C
  • SKU:
    2716809
  • Description:
    384CLBS XP LFXP3 144-LQFP field programmable gate array 1.6mm 1.8V 320MHz 0.63ns

LFXP3C-3TN144C Details

384CLBS XP LFXP3 144-LQFP field programmable gate array 1.6mm 1.8V 320MHz 0.63ns

LFXP3C-3TN144C Specification Parameters

  • Mounting Type: Surface Mount
  • RoHS Status: RoHS Compliant
  • Pbfree Code: yes
  • Lead Free: Lead Free
  • Packaging: Tray
  • Terminal Form: GULL WING
  • Peak Reflow Temperature (Cel): 260
  • Terminal Finish: Matte Tin (Sn)
  • Time@Peak Reflow Temperature-Max (s): 40
  • Operating Supply Voltage: 1.8V
  • Terminal Pitch: 0.5mm
  • HTS Code: 8542.39.00.01
  • Number of Outputs: 100
  • Length: 20mm
  • Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
  • Number of Terminations: 144
  • Pin Count: 144
  • Package / Case: 144-LQFP
  • Frequency: 320MHz
  • Number of Logic Cells: 384
  • Series: XP
  • RAM Size: 6.8kB
  • Combinatorial Delay of a CLB-Max: 0.63 ns
  • Organization: 384 CLBS
  • Base Part Number: LFXP3
  • Mount: Surface Mount
  • ECCN Code: EAR99
  • JESD-609 Code: e3
  • Part Status: Obsolete
  • Qualification Status: Not Qualified
  • Technology: CMOS
  • Reach Compliance Code: unknown
  • Moisture Sensitivity Level (MSL): 3 (168 Hours)
  • Supply Voltage: 1.8V
  • Height Seated (Max): 1.6mm
  • Terminal Position: QUAD
  • Number of I/O: 100
  • Published: 2000
  • Width: 20mm
  • Subcategory: Field Programmable Gate Arrays
  • Number of Pins: 144
  • Operating Temperature: 0°C~85°C TJ
  • Number of Logic Elements/Cells: 3000
  • Number of CLBs: 384
  • Voltage - Supply: 1.71V~3.465V
  • Total RAM Bits: 55296
  • Number of Logic Blocks (LABs): 375
  • Memory Size: 8.3kB
  • Power Supplies: 1.8/2.5/3.3V

Lattice Semiconductor — Manufacturer Introduction

Lattice Semiconductor
Lattice Semiconductor, founded in 1983 and headquartered in Portland, Oregon, is the global leader in smart connectivity solutions. They provide market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The company's broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

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