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- Manufacturer No：93LC46A/P
- Manufacturer：Microchip
- Category：Memory
- Datasheet：93LC46A/P
- SKU：518692
- Description：EAR99 Through Hole 93LC46A Tube ic memory 2MHz 2mus 2.54mm 2mA
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User Guide
93LC46A/P Details
EAR99 Through Hole 93LC46A Tube ic memory 2MHz 2mus 2.54mm 2mA
93LC46A/P Specification Parameters
- Part Status: Active
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mount: Through Hole
- ECCN Code: EAR99
- Radiation Hardening: No
- Lead Free: Lead Free
- Number of Terminations: 8
- Memory Width: 8
- Packaging: Tube
- Technology: CMOS
- Supply Voltage-Min (Vsup): 2.5V
- Factory Lead Time: 7 Weeks
- Published: 2001
- Operating Temperature: 0°C~70°C TA
- Memory Interface: SPI
- Power Supplies: 3/5V
- Memory Format: EEPROM
- Interface: Serial
- Clock Frequency: 2MHz
- Standby Current-Max: 0.000001A
- Write Cycle Time - Word, Page: 6ms
- Serial Bus Type: MICROWIRE
- Memory Size: 1Kb 128 x 8
- Additional Feature: 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
- RoHS Status: ROHS3 Compliant
- Mounting Type: Through Hole
- Number of Functions: 1
- Pbfree Code: yes
- JESD-609 Code: e3
- Number of Pins: 8
- Pin Count: 8
- Terminal Position: DUAL
- Terminal Pitch: 2.54mm
- REACH SVHC: No SVHC
- Terminal Finish: Matte Tin (Sn)
- Supply Voltage-Max (Vsup): 6V
- Supply Voltage: 2.7V
- Memory Type: Non-Volatile
- Data Retention Time-Min: 200
- Nominal Supply Current: 2mA
- Package / Case: 8-DIP (0.300, 7.62mm)
- Voltage - Supply: 2.5V~5.5V
- Endurance: 1000000 Write/Erase Cycles
- Access Time: 2 μs
- Write Cycle Time-Max (tWC): 6ms
- Write Protection: SOFTWARE
- Density: 1 kb
- Base Part Number: 93LC46A
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Microchip — Manufacturer Introduction
Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality.
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