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1N4370A
  • Manufacturer No:
    1N4370A
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    1N4370A
  • SKU:
    11177553
  • Description:
    Diode Zener Single 2.4V 5% 417mW 2-Pin DO-35

1N4370A Details

Diode Zener Single 2.4V 5% 417mW 2-Pin DO-35

1N4370A Specification Parameters

  • Part Status: Active
  • Number of Terminations: 2
  • Pin Count: 2
  • Mounting Type: Through Hole
  • Number of Elements: 1
  • RoHS Status: Non-RoHS Compliant
  • Peak Reflow Temperature (Cel): NOT SPECIFIED
  • Qualification Status: Not Qualified
  • JESD-609 Code: e0
  • Operating Temperature: -65°C~175°C
  • Factory Lead Time: 13 Weeks
  • Voltage Tolerance: 5%
  • Max Power Dissipation: 500mW
  • Diode Element Material: SILICON
  • Test Current: 20mA
  • Polarity: UNIDIRECTIONAL
  • HTS Code: 8541.10.00.50
  • Subcategory: Voltage Reference Diodes
  • Package / Case: DO-204AH, DO-35, Axial
  • Zener Voltage: 2.4V
  • Impedance: 30Ohm
  • Additional Feature: METALLURGICALLY BONDED
  • Current - Reverse Leakage @ Vr: 100μA @ 1V
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Number of Pins: 2
  • Packaging: Bulk
  • Mount: Through Hole
  • ECCN Code: EAR99
  • Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
  • Radiation Hardening: Yes
  • Tolerance: ±5%
  • Contact Plating: Lead, Tin
  • Terminal Form: WIRE
  • Voltage Tol-Max: 5%
  • Terminal Finish: Tin/Lead (Sn/Pb)
  • Published: 2005
  • Element Configuration: Single
  • Case Connection: ISOLATED
  • Diode Type: ZENER DIODE
  • Technology: ZENER
  • Max Reverse Leakage Current: 100μA
  • Reference Voltage: 2.4V
  • Impedance-Max: 30Ohm
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
  • Power Dissipation: 480mW

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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