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1N970B123
  • Manufacturer No:
    1N970B
  • Manufacturer:
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    Get the PDF file
  • SKU:
    13542030
  • Description:
    Bulk ±5% Through Hole Single Zener Diode 1.1V @ 200mA 5muA @ 18.2V 500mW 24V
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1N970B
  • Manufacturer No:
    1N970B
  • Manufacturer:
    Microsemi Corporation
  • Category:
    Diodes - Zener - Single
  • Datasheet:
    1N970B
  • SKU:
    13542030
  • Description:
    Bulk ±5% Through Hole Single Zener Diode 1.1V @ 200mA 5muA @ 18.2V 500mW 24V

1N970B Details

Bulk ±5% Through Hole Single Zener Diode 1.1V @ 200mA 5muA @ 18.2V 500mW 24V

1N970B Specification Parameters

  • Part Status: Active
  • Number of Pins: 2
  • Mounting Type: Through Hole
  • RoHS Status: Non-RoHS Compliant
  • Contact Plating: Lead, Tin
  • Operating Temperature: -65°C~175°C
  • Voltage - Zener (Nom) (Vz): 24V
  • Voltage Tolerance: 5%
  • Max Power Dissipation: 500mW
  • Power Dissipation: 500mW
  • Test Current: 5.2mA
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
  • Impedance-Max: 33Ohms
  • Current - Reverse Leakage @ Vr: 5μA @ 18.2V
  • Moisture Sensitivity Level (MSL): 1 (Unlimited)
  • Packaging: Bulk
  • Mount: Through Hole
  • Tolerance: ±5%
  • Min Operating Temperature: -65°C
  • Zener Voltage: 24V
  • Factory Lead Time: 13 Weeks
  • Max Operating Temperature: 175°C
  • Power - Max: 500mW
  • Element Configuration: Single
  • Impedance: 33Ohm
  • Package / Case: DO-204AA, DO-7, Axial
  • Supplier Device Package: DO-7

Microsemi Corporation — Manufacturer Introduction

Microsemi Corporation
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.

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