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- Manufacturer No：2N3700
- Manufacturer：Microsemi Corporation
- Category：Transistors - Bipolar (BJT) - Single
- Datasheet：2N3700
- SKU：11316737
- Description：Trans GP BJT NPN 80V 1A 3-Pin TO-18
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User Guide
2N3700 Details
Trans GP BJT NPN 80V 1A 3-Pin TO-18
2N3700 Specification Parameters
- Part Status: Active
- Packaging: Bulk
- Mount: Through Hole
- Radiation Hardening: No
- Factory Lead Time: 8 Weeks
- Min Operating Temperature: -65°C
- Max Collector Current: 1A
- Max Power Dissipation: 500mW
- Power Dissipation: 500mW
- Lifecycle Status: IN PRODUCTION (Last Updated: 1 month ago)
- Polarity: NPN
- Collector Emitter Breakdown Voltage: 80V
- Emitter Base Voltage (VEBO): 7V
- Current - Collector Cutoff (Max): 10nA
- Vce Saturation (Max) @ Ib, Ic: 500mV @ 50mA, 500mA
- Supplier Device Package: TO-18
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- Mounting Type: Through Hole
- Number of Elements: 1
- RoHS Status: Non-RoHS Compliant
- Number of Pins: 3
- Published: 2007
- Current - Collector (Ic) (Max): 1A
- Power - Max: 500mW
- Max Operating Temperature: 200°C
- Transistor Type: NPN
- Collector Emitter Voltage (VCEO): 80V
- Voltage - Collector Emitter Breakdown (Max): 80V
- Collector Base Voltage (VCBO): 140V
- Operating Temperature: -65°C~200°C TJ
- Package / Case: TO-206AA, TO-18-3 Metal Can
- DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 500mA 10V
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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