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- Manufacturer No：A1280A-CQ172C
- Manufacturer：Microsemi Corporation
- Category：Embedded - FPGAs (Field Programmable Gate Array)
- Datasheet：A1280A-CQ172C
- SKU：3927202
- Description：CMOS 2005 Non-RoHS Compliant FLAT field programmable gate array 0C~70C TA 5ns 50MHz 5V
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A1280A-CQ172C Details
CMOS 2005 Non-RoHS Compliant FLAT field programmable gate array 0C~70C TA 5ns 50MHz 5V
A1280A-CQ172C Specification Parameters
- Mounting Type: Surface Mount
- RoHS Status: Non-RoHS Compliant
- Part Status: Obsolete
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- Power Supplies: 5V
- Qualification Status: Not Qualified
- Technology: CMOS
- Published: 2005
- HTS Code: 8542.39.00.01
- Voltage - Supply: 4.5V~5.5V
- Operating Temperature: 0°C~70°C TA
- Programmable Logic Type: FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch: 0.635mm
- Number of Outputs: 140
- Combinatorial Delay of a CLB-Max: 5 ns
- Number of Gates: 8000
- Length: 29.972mm
- Series: ACT? 2
- Base Part Number: A1280
- JESD-30 Code: S-CQFP-F172
- ECCN Code: EAR99
- Surface Mount: YES
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Supply Voltage: 5V
- Packaging: Tray
- JESD-609 Code: e0
- Moisture Sensitivity Level (MSL): 3 (168 Hours)
- Terminal Position: QUAD
- Terminal Finish: TIN LEAD
- Terminal Form: FLAT
- Clock Frequency: 50MHz
- Subcategory: Field Programmable Gate Arrays
- Number of I/O: 140
- Number of Inputs: 140
- Number of Terminations: 172
- Width: 29.972mm
- Number of LABs/CLBs: 1232
- Height Seated (Max): 2.9464mm
- Package / Case: 172-CQFP with Tie Bar
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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