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- Manufacturer No：APTGT150TL60G
- Manufacturer：Microsemi Corporation
- Category：Transistors - IGBTs - Modules
- Datasheet：APTGT150TL60G
- SKU：12650789
- Description：IGBT MODULE 600V 200A 480W SP6
User Guide
User Guide
APTGT150TL60G Details
IGBT MODULE 600V 200A 480W SP6
APTGT150TL60G Specification Parameters
- Part Status: Active
- RoHS Status: RoHS Compliant
- NTC Thermistor: No
- Mounting Type: Chassis Mount
- Number of Terminations: 12
- Published: 2009
- Input: Standard
- Collector Emitter Voltage (VCEO): 600V
- Case Connection: ISOLATED
- Terminal Form: UNSPECIFIED
- Polarity/Channel Type: N-CHANNEL
- Mount: Chassis Mount, Screw
- Transistor Application: POWER CONTROL
- IGBT Type: Trench Field Stop
- Power - Max: 480W
- Turn On Time: 180 ns
- Turn Off Time-Nom (toff): 370 ns
- Configuration: Three Level Inverter
- Input Capacitance: 9.2nF
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- ECCN Code: EAR99
- Number of Elements: 4
- Number of Pins: 12
- Pin Count: 12
- Transistor Element Material: SILICON
- Collector Emitter Breakdown Voltage: 600V
- Gate-Emitter Voltage-Max: 20V
- Factory Lead Time: 36 Weeks
- Terminal Position: UPPER
- Max Collector Current: 200A
- Current - Collector Cutoff (Max): 250μA
- Subcategory: Insulated Gate BIP Transistors
- Max Power Dissipation: 480W
- Operating Temperature: -40°C~175°C TJ
- Package / Case: SP6
- VCEsat-Max: 1.9 V
- Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 150A
- Input Capacitance (Cies) @ Vce: 9.2nF @ 25V
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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