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- Manufacturer No：APTGT300SK170G
- Manufacturer：Microsemi Corporation
- Category：Transistors - IGBTs - Modules
- Datasheet：APTGT300SK170G
- SKU：11270723
- Description：IGBT MODULE 1700V 400A 1660W SP6
User Guide
User Guide
APTGT300SK170G Details
IGBT MODULE 1700V 400A 1660W SP6
APTGT300SK170G Specification Parameters
- Part Status: Active
- Number of Elements: 1
- ECCN Code: EAR99
- NTC Thermistor: No
- Number of Pins: 5
- Mounting Type: Chassis Mount
- Transistor Element Material: SILICON
- Input: Standard
- Case Connection: ISOLATED
- Terminal Form: UNSPECIFIED
- Terminal Position: UPPER
- Mount: Chassis Mount, Screw
- Terminal Finish: TIN SILVER COPPER
- Transistor Application: POWER CONTROL
- Current - Collector Cutoff (Max): 750μA
- Voltage - Collector Emitter Breakdown (Max): 1700V
- Collector Emitter Voltage (VCEO): 1.7kV
- Turn Off Time-Nom (toff): 1100 ns
- Power - Max: 1660W
- Input Capacitance: 26.5nF
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- RoHS Status: RoHS Compliant
- Pbfree Code: yes
- Number of Terminations: 5
- Pin Count: 5
- Published: 2006
- Configuration: Single
- JESD-609 Code: e1
- Factory Lead Time: 36 Weeks
- Operating Temperature: -40°C~150°C TJ
- Polarity/Channel Type: N-CHANNEL
- Max Collector Current: 400A
- Additional Feature: AVALANCHE RATED
- IGBT Type: Trench Field Stop
- Turn On Time: 450 ns
- Collector Emitter Breakdown Voltage: 1.7kV
- Package / Case: SP6
- Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 300A
- Max Power Dissipation: 1.66kW
- Input Capacitance (Cies) @ Vce: 26.5nF @ 25V
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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