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- Manufacturer No：APTGT50DH60TG
- Manufacturer：Microsemi Corporation
- Category：Transistors - IGBTs - Modules
- Datasheet：APTGT50DH60TG
- SKU：9733820
- Description：IGBT MOD TRENCH ASYM BRIDGE SP4
User Guide
User Guide
APTGT50DH60TG Details
IGBT MOD TRENCH ASYM BRIDGE SP4
APTGT50DH60TG Specification Parameters
- Moisture Sensitivity Level (MSL): 1 (Unlimited)
- RoHS Status: RoHS Compliant
- Time@Peak Reflow Temperature-Max (s): NOT SPECIFIED
- Number of Pins: 4
- Qualification Status: Not Qualified
- Mount: Chassis Mount
- Pin Count: 14
- Input: Standard
- Part Status: Discontinued
- Case Connection: ISOLATED
- Terminal Position: UPPER
- Collector Emitter Voltage (VCEO): 1.9V
- Current - Collector Cutoff (Max): 250μA
- Additional Feature: AVALANCHE RATED
- IGBT Type: Trench Field Stop
- Turn On Time: 170 ns
- Turn Off Time-Nom (toff): 310 ns
- Power - Max: 176W
- Configuration: Asymmetrical Bridge
- Input Capacitance (Cies) @ Vce: 3.15nF @ 25V
- Number of Elements: 2
- Pbfree Code: yes
- Peak Reflow Temperature (Cel): NOT SPECIFIED
- NTC Thermistor: Yes
- Mounting Type: Chassis Mount
- Number of Terminations: 14
- Transistor Element Material: SILICON
- Collector Emitter Breakdown Voltage: 600V
- JESD-609 Code: e1
- Terminal Form: UNSPECIFIED
- Polarity/Channel Type: N-CHANNEL
- Max Collector Current: 80A
- Terminal Finish: TIN SILVER COPPER
- Transistor Application: POWER CONTROL
- Operating Temperature: -40°C~175°C TJ
- Package / Case: SP4
- Max Power Dissipation: 176W
- Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 50A
- Input Capacitance: 3.15nF
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Microsemi Corporation — Manufacturer Introduction
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services.
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